Electronics Forum | Sun Nov 29 20:04:05 EST 2009 | prodivegsr
Hi sforman1, The chemical that i'm using is a solvent based coating humiseal 1B73. From my understanding,the UV curing is mainly for UV curable coating like the UV40. And the main advantage of using UV curing is for fast throughput and environment
Electronics Forum | Mon Nov 30 09:05:47 EST 2009 | sforman1
totally wrong. a. I do not reccomend Humiseal UV products. My Dad started Humiseal. b. As the former VP of Dymax Corporation I know quite a bit about this subject. Contact Dymax in Torrington, CT and inquire about 984LV. c. You will definetly sleep b
Electronics Forum | Wed Dec 02 00:31:37 EST 2009 | jlawson
UV40 for you info was developed in Humiseal EU and has been tested heavily against Dymax product. UV40 is a great product has many approvals from major auto and whitegoods makers.... I have seen comparisons UV40 to Dymax 984LV and Dymax comes out se
Electronics Forum | Sat Nov 21 09:13:57 EST 2009 | patrickbruneel
In addition to Dave’s response Yes tin dissolves (corrodes) other metals even at room temperature, just a whole lot slower. The affinity of tin to dissolve other metals is most effectively neutralized with the addition of lead. It is not by accident
Electronics Forum | Fri Nov 20 14:50:13 EST 2009 | davef
One of our instruments has a high impedance front-end. We: * Passed functional test in the environmentally controlled shop. * Failed test, on the same unit, while carrying it to burn-in chambers in an uncontrolled part of the plant. Solder flux resi
Electronics Forum | Sat Nov 21 01:42:28 EST 2009 | Sean
Hi Patric, You are right...WE found that this problem disappear once we seal the PCBA bottom side (Intel's Northbridge area). Once we remove the seal, the problem is coming back.. In this case, I thnk conformal coating is necessary... Besides, I
Electronics Forum | Fri Nov 20 12:41:41 EST 2009 | brycearkos
Has anyone attempted to, or successfully used a custom made (DIY) protective thermal enclosure for the Super M.O.L.E. gold profiler? We recently purchased a Bravo oven that came with everything for the ECD profiling system... except for the thermal
Electronics Forum | Mon Nov 23 20:16:11 EST 2009 | davef
We're not familiar with Loctite 3606. Adhesive bond strength must be adequate to survive handling forces between the adhesive cure station and the soldering station. At the soldering station, the adhesive will soften during the preheat stage and in
Electronics Forum | Thu Dec 17 03:55:41 EST 2009 | tod1967
Inspect your dispensed or printed adhesive deposits 100%, make sure your Pnp gives 100% 1st time placement and your cure is adequate. Conveyor or manual brd transfer can also be an issue. usually is in the process. Hopefully your following Loctite
Electronics Forum | Wed Dec 23 12:50:38 EST 2009 | stepheniii
Make sure you(not someone simply telling you) check that the components are actually on the board before the wave. I think we had a thread once that started with someone saying they had parts falling off in the wave and ended with the person saying
