Electronics Forum | Thu May 21 09:41:34 EDT 1998 | Gary simbulan
| | | | | 310-433-7000 Topline | | | 714-899-8309 Practical Components | | | | Thanks for the numbers Michael, but I am still getting a "this number has been disconnected" message for TopLine. Maybe their competitor has what I need | | Gary | Gar
Electronics Forum | Wed May 20 22:52:37 EDT 1998 | Dave F
| I'm looking to increasing my prototyping capabilies by getting some automated pick and place equipment etc. Any leads on where to start investigating? I'm a very small job shop with 5 employees. Any help would be greatly appreciated. Greg: Le
Electronics Forum | Mon May 18 16:31:59 EDT 1998 | Jerry
.025" pitch so the only problem we run into is too much HASL on the adhesive side causing improper glue dispense. As Earl keeps saying HASL thickness is hard to impossible to control. I think we need to look hard at OSP's again but then you get into
Electronics Forum | Tue May 19 02:59:46 EDT 1998 | P.L. Sorenson - Technical Consultant
| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |
Electronics Forum | Thu May 14 14:48:45 EDT 1998 | Dave F
We understand that testing for ionic contamination and surface insulation resistance measure different properties. We assemble printed circuit boards for other companies. We will not get combs on 90% of the boards that we assemble. We have no custo
Electronics Forum | Wed May 27 15:50:04 EDT 1998 | Rick
The KIC Prophet system does indeed deliver as promised. The Slim-KIC (datalogger portion) works well and is worth the price of admission by itself. The Prophet portion of the system (resident in the oven) works great and decreases the requirement for
Electronics Forum | Fri May 15 18:13:35 EDT 1998 | Earl Moon
| | | Does the temp. profiles used to reflow double sided pcb's through a IR oven | | on FR4 board material have to be re-established if it is changed to | | polyimide? Boards will be baked out prior to assembly. | | any response would be most appr
Electronics Forum | Tue May 12 08:56:54 EDT 1998 | Process Engineer
I'm in the process of doing an evaluation fora big board machine. My choices are Universal HSP 4791 and Fuji CP6-5. Has anyone one a subjective evaluation on both machines? If so what was the outcome, abd experiences since installing the selected mac
Electronics Forum | Sun May 10 06:40:28 EDT 1998 | PhingMae
Hello. 1 Could anyone tell me the range of temperature to solder MI components? The process eng is using 400~500 degrees Celcius!! For standard 0805/0603 chips & TH components & also to touch up on ICs. What is the consequence?
Electronics Forum | Fri May 08 15:12:23 EDT 1998 | Ryan Jennens
I am running boards with gold fingers on a pallet for masking purposes. The pallets worked fine for a while but know the gold fingers are getting solder on them. We have tried everythin: new pallets, cleaning the pallet and board to be sure there
