Electronics Forum: viewed (Page 6174 of 7906)

Lite-On side looking LED assembly problems

Electronics Forum | Wed Jun 04 21:11:11 EDT 2014 | isd_jwendell

This style gave me grief as well. The problem is the way the part is manufactured leading to an unusual pad configuration. When the part is placed on the PCB there is no pad wrap under the part, the pad is 90 degrees to the board. The datasheet shows

CP40LV Part Rotation

Electronics Forum | Thu May 29 19:26:06 EDT 2014 | wesleyintelli

Hi, We have recently installed a CP40LV+. Unfortunately the machine fails to do the pre-rotation (from feeder to library) when placing parts and as a result throws an error after scanning the part. However, it works when test picking the part. We h

Thiourea exposure in manual soldering of immersion tin PCBs

Electronics Forum | Sun Jun 01 03:42:49 EDT 2014 | sync40

Hello to everybody in this forum, I would like to know any information that you kindly may have about the following subject: We very often do manual soldering assembly of immersion tin finished PCBs. Since thiourea is used in the formulation of the

Thiourea exposure in manual soldering of immersion tin PCBs

Electronics Forum | Sun Jun 01 13:25:26 EDT 2014 | davef

Eurolanders and Asians are the primary users of immersion tin. In the US, the use of immersion tin is restricted due to the concern over the thiourea that used in tin plating process. Thiourea is a suspected carcinogen. I’m inclined to say, “aww, as

Mechanical Delamination at de-panel

Electronics Forum | Wed Jun 04 10:51:28 EDT 2014 | clydestrum

Well, we cannot make the cuts any deeper as then we would incur a significant amount of "bowing" at SMT placement/reflow. -Has anyone ever heard of changes in material/laminate makeup that causes this? A sort-of stronger, or more flexible tensile st

Mechanical Delamination at de-panel

Electronics Forum | Mon Jun 09 10:03:40 EDT 2014 | clydestrum

Well, typically we put rails on a lot of the boards due to the absence of fids and/or tooling holes. We do have a fixture that is somewhat universal that I could try to introduce into the next run. Unfortunately, the next run does not help my proble

Mechanical Delamination at de-panel

Electronics Forum | Fri Jun 13 16:23:47 EDT 2014 | esoderberg

I did not see any mention on the inner layer setback. We use 0.025" and have not had problems. Point loads with either a CAB or a FKN can sometimes be problematic. I would search out someone you know that has a fancort industries VDP5. This cuts th

Problem on Setting Cisco Switches on the IP-MAC Binding

Electronics Forum | Wed Jun 04 02:54:15 EDT 2014 | jasmine01

Q:Why we need to bind MAC and IP Address under a switched network ? How to set Cisco Switch on the IP-MAC Binding ? A:The binding between MAC address and IP address can avoid embezzlement of internal IP addresses. As we know IP address is very easy

Flaky Capacitor

Electronics Forum | Fri Jun 06 16:25:03 EDT 2014 | spitkis2

Component manufacturers subject their lots to thermal / reflow testing per IPC /JEDEC STD-020. This involves running the parts through an oven 3X with a peak above 260C. I am not certain if passives go through the same test (theoretically they shou

chip placed upside down

Electronics Forum | Sat Jun 07 23:37:34 EDT 2014 | demzvill

Hello all Good morning. I just want to ask with you guys about the problem that we always experienced in our production. We could not get our target ppm due. to inverted placement of chip resistor. We are using 2000 series juki mounter and cf03hp j


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