Electronics Forum | Thu Oct 02 04:39:08 EDT 2014 | oxygensmd
I had the same problem with my E5. At first check the cover and valves in the squeegees head. For me wasn't help, I didn't found any fault, jamm. In my machine there is two adjustable valve over the transport at output-vent. I tried to readjust the
Electronics Forum | Wed Oct 01 07:22:11 EDT 2014 | oguzdtas
First all, I am very new about all this stuff so please forgive me if i say anything wrong. We are using a universal vcd axial. We had a problem with cut and clinch. We blieve if we lengthen the wreck material going inside the tubes, the problem wil
Electronics Forum | Wed Oct 01 15:24:55 EDT 2014 | horchak
are you trying to lengthen or shorten the lead length? Lengthening the amount of lead being cut off and going into the scrap tube will shorten the lead length. Lead length is pretty much determined by the down stop setting on the insertion head, the
Electronics Forum | Fri Oct 03 05:59:20 EDT 2014 | cmchoue
Does anyone well know in "via hole design in ground pad" I have few question that i want to know the answer,thanks. 1.Thermal performance compare about a.Via Full Stuff (top/bottom:solder mask and inside is air) b.Via Half Stuff (bottom:solder mask
Electronics Forum | Thu Oct 30 23:39:10 EDT 2014 | beilimanu
No paper thing, while I can make some suggestions based on my experience. what is the size of your via? If it's smaller than dia0.4mm, in PCB production process it should be filled by soldermask. So my suggestion is design it to be full filled by SM
Electronics Forum | Tue Oct 07 10:23:35 EDT 2014 | reballer
I have been applying solder spheres to BGA packages. During the process, the spheres are run over a stencil for placement. The spheres tend to stick to each other (and clump), even away from the stencil pattern, when it is humid in the work area. I'm
Electronics Forum | Mon Dec 29 16:49:57 EST 2014 | emanuel
Hi Rob, I am writing this reply as an update. Unfortunately I got your recommendation a bit too late, I contacted Count-On Tools and ordered from them a custom made nozzle for the Emerald. $300 paid for the "pleasure", everything could be OK if it w
Electronics Forum | Tue Oct 14 19:11:44 EDT 2014 | caurbach
We have a 6622CC machine for SnPb boards. A few things you may want to try: - Solderability testing on the components/PCB. - If the fuse holders or copper in the board are sucking up all the heat, try increasing preheat. Some fluxes (like the WS f
Electronics Forum | Wed Oct 15 23:41:34 EDT 2014 | padawanlinuxero
Hello Chris I had a similar problem, what work for us was a combination of fluxer and preheat, we try different approaches what work was high pressure and a low traverse speed, and really heating up the upper part of the board, you see we need to u
Electronics Forum | Thu Oct 09 17:37:58 EDT 2014 | rgduval
Got a failure while starting up our GSM, and hoping you guys have an easy fix that we're not seeing. We're getting a Timeout waiting for nozzle changer vacuum buildup. It seems to be occurring on head 2, during nozzle change. We've reseated all of
