Electronics Forum | Mon Nov 27 12:38:10 EST 2000 | rabell
There are a number of issues here. One is having good benchmarks prior to training. Most companies monitor production issues like inventory, scrap, rework, etc. A good ESD program would be performing frequent audits and recording deviations. Hard
Electronics Forum | Thu Oct 26 17:48:12 EDT 2000 | ptvianc
Hi: Generlly speaking, in a reactive mode, nitrogen blankets are used to improve the yield of a process that is marginal in terms of removing, and/or preventing the re-appearence of, oxides on copper features or component I/Os. That marginality can
Electronics Forum | Thu Oct 26 13:56:08 EDT 2000 | ptvianc
Hello: Pre-baking laminates should only be performed:(1) to meet contractual agreements or (2) in response to an actual defect that can be traced to PWB water absortion. Besides the fact that a pre-bake is an enormous process "bottleneck," it also
Electronics Forum | Thu Oct 26 12:56:50 EDT 2000 | ptvianc
That is a tough question. I think that an important point must be made, and that is that the electronics assembly business is just that, a business. And, electronics asssembly companies are in business to make a profit. The profit, or "bottom line
Electronics Forum | Thu Oct 26 13:10:48 EDT 2000 | ptvianc
Yes, one should always be concerned about "field failures" because they represent the point at which the product has exceeded its design lifetime with respect to its service conditions. Hybrid microciruit technolgy (HMC) has been around for a long t
Electronics Forum | Thu Oct 26 13:26:53 EDT 2000 | ptvianc
Hello: 1. Yes, it is necessary to reball a PBGA after removal from the board. Once the part has been removed, the quantity of solder on the balls is out of control. This condition will not only result in an unacceptable variation in solder quantity
Electronics Forum | Thu Aug 24 09:23:29 EDT 2000 | Dr. Ning-Cheng Lee
You are asking a very good question which has been an issue in the industry for a long long time. For operating at 225C, you will need a solder with melting point no lower than 270 or even 280C. HMP solder is very difficult to come by. At this stage,
Electronics Forum | Tue Aug 22 16:02:07 EDT 2000 | Dr. Ning-Cheng Lee
If the thermal mass of the products is small, a tent-shaped profile is recommended, with peak temperature around 240C. The hottest spot on board should be less than 250C. However, if the thermal mass of the product is large, such as a large server PC
Electronics Forum | Thu Jul 20 16:10:34 EDT 2000 | armintan
Hi Bob, From my memory about almost 4 yrs. ago, I remember we did something similar to this in Apple Computer Singapore. Process sequence are: Bottom Side Process: Print Solder Paste(Dek 265GS) Dispence Adhesive (Cam/Alot 3800) Place Components (
Electronics Forum | Thu Jul 20 13:28:13 EDT 2000 | Bob Willis
On all the trials I have done I have made no changes to the stencil thickness or apertures than the normal changes we make for our process. I have not changed any thing in terms on volume of solder for more reliable joints. I fact I have not read any
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