Electronics Forum | Thu Jan 03 15:20:02 EST 2002 | Luis F. Otero
What method of depanelization is used to depanelize circuit boards made of flexable ribbon cable material.Any input welcomed. Luis F. Otero (915)-780-5504
Electronics Forum | Thu Jan 03 21:43:20 EST 2002 | davef
Resistivity [1/ohm] readings are determined by the "cleanliness" that you desire to ensure the proper performance of your product. Check the fine SMTnet Archives for background. Contact USFilter [ http://www.usfilter.com/ ] for help.
Electronics Forum | Fri Jan 04 12:07:45 EST 2002 | stefwitt
I would like to expand your request for Siplace users. However, file sharing in Unix or Linux format is a bit different. Does anyone know how to zip these files in Windows to share?
Electronics Forum | Fri Jan 04 11:16:02 EST 2002 | jsmith01
Does anyone have or know of a standard that deals with the shrinkage % of SMT components. One of my customers has asked for this to enter into their MRP system. I could make a guess but it would be nice to know if there is a standard to compare it
Electronics Forum | Fri Jan 04 13:10:07 EST 2002 | Dave G
Are they talking about size or qty ? Accountants sometimes refer to shrinkage when they are talking about inventory quantity discrepancies. Just asking, Don't know of a std that refers to this. Dave
Electronics Forum | Fri Jan 04 15:27:04 EST 2002 | davef
There is no standard. Component loss is a function of many factors, including: * Component type. * Component packaging. * Machine capabilities. * Feeder maintenance. Search the fine SMTnet Archives on attrit* for some guidelines.
Electronics Forum | Sat Jan 05 02:03:19 EST 2002 | hany_khoga
Dear all: For PBGA replacement by a hot air BGA rework station, do I have to follow the same temperature profile as the first original one in the reflow oven? Note that in the rework process I use only Flux paste (no solder paste is used). Hany
Electronics Forum | Mon Jan 07 20:29:59 EST 2002 | davef
Your PBGA rework temperature profile should be similar to the same temperature profile as the first original one in the reflow oven. Searching the fine SMTnet Archives gives almost 500 postings on BGA and rework*.
Electronics Forum | Mon Jan 14 20:33:33 EST 2002 | dason_c
Can we say the "Jiffy Pop" is same as void? Also, please provide the manufacturer location, Malaysia?
Electronics Forum | Mon Jan 07 09:23:07 EST 2002 | albertoh
Hi!! I need some information about how to rework fine pitch components which had been rejected by machine and has coplanarity damage. Does anyone know a procedure that can help me? Thanks in advance. Regards