Electronics Forum | Fri May 31 16:42:33 EDT 2002 | TheConsultant
If you provide some information regarding the number of different products you are running per line and typical lot sizes I will provide you with some typical numbers. TheConsultant
Electronics Forum | Mon Jun 17 11:06:31 EDT 2002 | cfraser
I agree totaly and would like to thank Mr. Bliss for his reply. I would also suggest that anyone who is serious about SMT manufacturing, read the "White Pages" on the Bliss Tech. site. The concepts are very basic but still good. Thanks to all of you
Electronics Forum | Mon Jun 17 19:18:40 EDT 2002 | dlkearns1
I've seen where companies (in the U.S.) are unhappy with the quality of certain china manufactures, and are in process of aquring pick and place equipment and do the boards in house.
Electronics Forum | Fri May 17 14:12:17 EDT 2002 | dason_c
Not now, Valor may under develop the module for its Trilogy 5000 with the stencil aperture based on the rules which you set. Also, check with IRI stencil (Alpha), they have a s/w and based on using ODB++ file and not Gerber. Rgds.
Electronics Forum | Wed May 22 12:32:49 EDT 2002 | pwrgroup
which stencil vendor can deliver aspect ratio and area ratio and the statistical information to the user?It's difficult if the pad is modified.
Electronics Forum | Wed May 22 12:39:00 EDT 2002 | pwrgroup
and the two ratio is changed if you use different thickness sheet or step-down or step-up.I think real time calculator of the two ratio is very important for tranfer efficience.
Electronics Forum | Wed Feb 05 10:26:18 EST 2003 | russ
Go one to one at 7mils for these connectors. Generally your stencil shop will do this for you. Somebody has the artwork since a stencil was made for it at sometime? Russ
Electronics Forum | Fri May 17 16:37:28 EDT 2002 | Tom Druan
I was wondering if anyone could direct me towards documentation on shear test methods/apparatus to test the bond integrity of a solder ball to its substrate. Thanks.
Electronics Forum | Fri May 17 16:53:50 EDT 2002 | davef
I recall a couple of papers in the SMTA 'Knowledgebase' that used ball shearing and an element in a study that compared BGA [maybe uBGA] component fabrication methods, er sumpin.
Electronics Forum | Mon May 20 13:48:43 EDT 2002 | sbuckley
What is the recommended prep for a through-hole glass pack diode? Should a stand-off be used or can it lay flat on surface of the pcb?
