Electronics Forum | Mon Jan 17 10:50:56 EST 2000 | Dave F
Continuing on the the discussion of using gloves in a no-clean soldering environment: * Sure, some people use gloves when handling boards in a no-clean soldering environment * There may be some benefit to using gloves when no-clean soldering * Yo
Electronics Forum | Tue Jan 04 17:27:43 EST 2000 | John Thorup
For clipping off small boards and small quantities you can try Simonds. With no components and for longer straight cuts a shear would be more appropriate. How about the various de-panelling machines? The answer could be more specific if you would te
Electronics Forum | Tue Jan 04 08:24:31 EST 2000 | vinceh
We are to use a special pressfit connector. Indeed, one side of the connector is overmoulded in a housing, and the other side will be pressfitted on a board. We would like to know: 1) Are such applications yet existing ? 2) What are the type of inser
Electronics Forum | Tue Jan 04 07:22:12 EST 2000 | Michael Selva
One of the boards has a via designed right in the middle of a pad for a 1206 cap, one side only. This causes the solder paste to run into the via during reflow. We run No-Clean paste. One alternative is to increase the aperture on the stencil for tha
Electronics Forum | Wed Jan 05 12:48:44 EST 2000 | Dave F
Millerin: You are generally correct about plugging and over plating vias, but in Michaels case, the via is blind. Plugging would trap air between the bottom of the via and the plug material, causing an air pocket. When heated to soldering temperat
Electronics Forum | Mon Jan 10 10:02:57 EST 2000 | Istv�n Dominik
We had the same problems. Certainly the best solution to redesign the boards. Otherwise the holes must be plugged. We tried many solutions (more paste, printing twice etc.) but the result was almost the same. Finally we printed solderpaste only on th
Electronics Forum | Mon Jan 10 19:13:46 EST 2000 | TNT
HELLO MIKE, THE PROBLEM WITH THE VIA BEING IN THE MIDDLE OF THE PAD CAN BE HANDLED. IF YOU ARE HAVING PROBLEMS WITH SOLDER FLOWING THROUGH AT REFLOW YOU MIGHT WANT TO CHECK YOUR VACUUM AT YOU SCREEN PRINTER. SOMETIMES THE VACUUM THAT HOLDS THE PCB
Electronics Forum | Mon Jan 03 14:00:06 EST 2000 | John Anderson
Has anyone had luck with 0201 cap board design, solder printing and reflow? IPC-SM-782 does not provide much help. I am particularly interested in attach pad design, stencil aperture design and thickness, solder paste (mesh, metal content, etc.), and
Electronics Forum | Tue Jan 04 11:25:34 EST 2000 | Brian E. Steelglove
John, I work for Panasonic Create and I just got back from Japan where we sat through a presentation on pad layout and stencil layout on the 0201. Please give me your fax number and I will send it right over. Sorry I do not have it on disk. Bria
Electronics Forum | Wed Jan 05 06:55:48 EST 2000 | Mark Alder
Please go into s.m.t.net archives 19/2/1999 and have alook at the suggestions I received.I have found them to be fairly accurate and work pretty good.Lazer cut stencils also made a significant improvement.The adhesive I used was AMICON D125F3 from Em
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