Electronics Forum | Tue Sep 05 09:54:33 EDT 2006 | slthomas
We had the same problem with our E5. I had the shop make us a template for each two-sided board out of some 1/16" acrylic. The template had cutouts in it to drop the pins through where the bottom side parts weren't. Seemed to work fairly well, no com
Electronics Forum | Wed Sep 06 03:53:49 EDT 2006 | dougs
we do a similar thing but make the template from paper, we just print out an image from the gerbers (to size) showing both sides in different colours, we set this down on the table (had to work out first where the correct position was) then we place
Electronics Forum | Wed Sep 20 15:56:44 EDT 2006 | Rapid
There is a quick change dedicated tooling solution. It involves a "h-tower" and a machined vacuum (or non-vacuum) plate. There are two 8mm threaded holes on the table that are there for support tooling interface. The tower or tooling bolts to thos
Electronics Forum | Tue Sep 05 23:04:51 EDT 2006 | davef
Lets be clear: * Capabilities of a test machine is defined by the equipment manufacturer. * Capabilities of test machine specific software is defined by the equipment manufacturer. * Coverage of the unique testhead is defined by the end-user that pur
Electronics Forum | Thu Sep 07 17:24:29 EDT 2006 | greg york
normally one side is hydroentangled the other is not there is only one correct side which should be lint free and the other full of lint.that is wny people should never use rolls on both sides. Im of course talking typically (not sure of jnj brand) t
Electronics Forum | Thu Sep 07 07:41:06 EDT 2006 | Bubba
Check for coplaner leads if this just exists at reflow process, i.e. look at part before oven, turn on 3D at placement machine. If you see after wave solder, the wave could cause coplanarity issues on top as well if you are going slow enough to refl
Electronics Forum | Thu Sep 07 10:32:12 EDT 2006 | slthomas
Is the solder reflowing on the pad but not wicking up the lead, or does there appear to be insufficient solder to wet both, or is it not reflowing at all, or.....? Have you verified your profile? What is the condition of your paste (expiration date,
Electronics Forum | Fri Sep 08 10:23:38 EDT 2006 | slthomas
By profile (profile has not been changed) are you referring to the oven zone settings or the actual charted profile of a trip through the oven as recorded by a thermal profiler? Some ovens will continue to function without warning as long as temps
Electronics Forum | Thu Sep 07 11:01:52 EDT 2006 | davef
BGA cracking is caused by mechanical stress. This may be the result of: * Rough handling of soldered board * Inadequate consideration during package design of CTE effects on BGA * Poor control of or selection of thermal ramp rates during soldering
Electronics Forum | Sat Sep 16 12:44:29 EDT 2006 | Grant
Hi, Could it be shocks in transit? This is only happening on 1 product, so might point to chassis and packing design. Does anyone know of any shock indicators that we could put inside the chassis to see if the faults are caused by this? I have seen
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