Electronics Forum | Tue Aug 02 22:49:55 EDT 2005 | davef
IPC-A-610D Section 5, shows a variety of photographs of: * Good lead-free solder connections * Lead-free soldering anomalies Hot Tear / Shrink Hole is one such anomaly. This shrinkage effect appears primarily on wave-soldered joints, but can also
Electronics Forum | Mon Aug 01 20:02:20 EDT 2005 | Joseph
We use SAC305 and top side particular joint temp. is 110 deg C, and the terminal finish for that particular lead is pure tin. It look like hot tearing at the primary side of PTH.
Electronics Forum | Fri Jun 09 07:26:24 EDT 2006 | amol_kane
hi, gald to hear that yr process is working well.....we are in the process of buying a wave with SN100C solder.....any pitfalls/precautions that you took during the transition? did you do any DOE for setting up the profile values?? are you seeing a
Electronics Forum | Fri Jun 09 11:55:34 EDT 2006 | jbrower
Howdy Amol, As far as I can see, there aren't too many pitfalls with SN100C. Just make sure to keep all of your alloys seperated. The issues that I am working out right now is the profiles with our wave pallets and some of our larger components. We
Electronics Forum | Tue Aug 05 01:13:22 EDT 2008 | Sean
Dear all, As far as I know hot tear or shrink hole defect only happen at plated though hole soldering, especially for those lead free wave process. Recently, a laboratory engineer had done cross section on some of the SMT BGA ball and IC lead solde
Electronics Forum | Fri Aug 08 07:15:49 EDT 2008 | davef
Hot tear occurs at the surface of the solder connection. The surface will look like someone tore the surface apart. So, it is a crack or fracture formed prior to metal solidification.
Electronics Forum | Wed Aug 06 08:09:57 EDT 2008 | davef
We agree that the squigglie part of the section of the BGA ball looks like something other than 'hot tear.' We'd guess that it is an inclusion, but it could be a sectioning defect, as you say. We agree that the majority of occurances of hot tear are
Electronics Forum | Tue May 08 10:31:04 EDT 2007 | Yankee
Hi all, I think Hot Tear or Shrink Hole defect is common in LEAD FREE wave soldering, especially those solder is from SAC type. As far as I know, it is related to cooling rate. Is there anyone know how to solve or reduce this defect at wave solder
Electronics Forum | Tue May 08 22:34:53 EDT 2007 | davef
Do you mean "how to solve or reduce this defect at wave soldering process" while continuing to use-up my SACX solder? If so, try: * Smaller solder volumes lower shrinkage hole / hot tears [Higher hole diameter versus pin diameter helps in reducing v
Electronics Forum | Wed Mar 22 01:24:54 EST 2006 | Joseph
Dear all, Referring technical report from Vitronics Soltec, "Pad lifting, fillet lifting and fillet tearing issues in LF soldering". The use of LF solder alloys today has brought about a recurrence of this crack formation, called fillet tearing. The
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