Electronics Forum | Tue Aug 05 01:13:22 EDT 2008 | Sean
Dear all, As far as I know hot tear or shrink hole defect only happen at plated though hole soldering, especially for those lead free wave process. Recently, a laboratory engineer had done cross section on some of the SMT BGA ball and IC lead solde
Electronics Forum | Fri Aug 08 07:15:49 EDT 2008 | davef
Hot tear occurs at the surface of the solder connection. The surface will look like someone tore the surface apart. So, it is a crack or fracture formed prior to metal solidification.
Electronics Forum | Wed Aug 06 08:09:57 EDT 2008 | davef
We agree that the squigglie part of the section of the BGA ball looks like something other than 'hot tear.' We'd guess that it is an inclusion, but it could be a sectioning defect, as you say. We agree that the majority of occurances of hot tear are
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