Electronics Forum | Fri Jun 08 16:36:58 EDT 2012 | noid
KIC 24/7 has evolved into RPI. Not only will it give you virtual profiles, it also gives you DPMO and yield, based where each board lands in the process window. The good thing about this software, you can go back a year later and look up a specific
Electronics Forum | Sat Mar 21 12:10:03 EST 1998 | Philip C. Kazmierowicz
| Cpk's on top flight ovens (e.g., Conceptronics, Heller, Electrovert, Vitronics) vary wildly, from 1 to 2+, between different supplers. The suppliers don't seem to understand Cpk's. A supplier's rep whose oven has a Cpk of 1.0 told me: | 1. Cpk's
Electronics Forum | Sat Mar 21 16:33:09 EST 1998 | Earl Moon
| | | Cpk's on top flight ovens (e.g., Conceptronics, Heller, Electrovert, Vitronics) vary wildly, from 1 to 2+, between different supplers. The suppliers don't seem to understand Cpk's. A supplier's rep whose oven has a Cpk of 1.0 told me: | | 1.
Electronics Forum | Wed Jun 06 20:49:36 EDT 2012 | edri_mun
we encounter the same problem as you 3 years ago. but now we have implement to use KIC 24/7. you just need to take 1 time profile (for the base line profile), and then for the next time you run your product, it will take profile for each board you b
Electronics Forum | Tue Oct 27 16:11:36 EST 1998 | carl m
| | | | What are the key feature to look for in buying a profiling product for Reflow ? | | | | | | Who's is the best and how much do these systems cost ? | | | | | | Thanks in advance. | | | | | | Hi Mark, | | | | I am currently the oven secto
Electronics Forum | Thu Sep 23 11:56:30 EDT 2004 | rkevin
We are printing on an assembly using SAC305 Alloy Sn96.5 Ag 3 Cu .5 with a no clean flux and getting virtually NO spread with either a ramp to spike or straight ramp profile. We are printing to standard FR4 board with immersion Ag finish. I am trying
Electronics Forum | Wed Dec 20 22:24:03 EST 2000 | Greenman
Dave: In terms of heat transfer, air is 78% nitrogen, and the remainder is mostly (20.9%) oxygen (roughly the same molecular weight as nitrogen), with a bit of argon (0.9%), CO2, hydrogen, monosodium glutamate etc. So you would expect virtually no d
Electronics Forum | Wed Dec 20 22:25:26 EST 2000 | Greenman
Dave: In terms of heat transfer, air is 78% nitrogen, and the remainder is mostly (20.9%) oxygen (roughly the same molecular weight as nitrogen), with a bit of argon (0.9%), CO2, hydrogen, monosodium glutamate etc. So you would expect virtually no d
Electronics Forum | Wed Dec 20 22:26:01 EST 2000 | Greenman
Dave: In terms of heat transfer, air is 78% nitrogen, and the remainder is mostly (20.9%) oxygen (roughly the same molecular weight as nitrogen), with a bit of argon (0.9%), CO2, hydrogen, monosodium glutamate etc. So you would expect virtually no d
Electronics Forum | Thu Sep 23 23:42:52 EDT 2004 | KEN
The LF pastes will have virtually NO wetting spread. This is normal. LF mobilities are virtually non-existant with SAC alloys. However, the addition of varrying amounts of silver can (and does) improve mobility but, this comes with a price (paste
