Electronics Forum | Mon Feb 10 14:34:56 EST 2014 | jigo91
Hi, I wanted to know how can we test our paste quality, as viscosity, temperature in which it is delivered to the SMT line and other variables that can affect our paste dispense or soldering. Our concerns are that paste quality may be causing solde
Electronics Forum | Mon Feb 10 16:59:57 EST 2014 | hegemon
It is sort of a self answering question if you come in from the solder paste angle. First....start gathering data. Check every day, or every new paste jar, for: Storage conditions (temp), paste expiration date, ambient temp and humidity where yo
Electronics Forum | Fri Feb 03 07:06:22 EST 2017 | emeto
It makes sense. With temperature viscosity will change, and more liquidus material will flow better.
Electronics Forum | Mon Jul 26 11:01:35 EDT 1999 | Kevin Hussey
| Has anyone ever heard of testing solder paste quality by pasting a board and making a determination of the quality by measuring paste height and width after the board is pasted. Would you consider this a valid test for solder paste testing? | I ha
Electronics Forum | Wed Nov 02 11:01:56 EDT 2022 | tommy_magyar
Ellaborating on Evtimov's answer: - solder paste type, think about solder granulation and viscosity. Both of these will directly affect print quality if wrong print parameters used. You will normally find recommended print parameters on the solder pa
Electronics Forum | Thu Nov 21 02:43:07 EST 2002 | jate
Hi, Jar's quality is easier to measure. If you want to know paste viscosity etc. it's easier if you use jar. I have bad experiences about cartridges. I used cartridges for a short time but I change it back to jar because flux separated too easily in
Electronics Forum | Mon Aug 22 10:33:23 EDT 2005 | davef
Q1. What is recommended viscosity standard? A1: There is no standard. ASTM D4040-05 "Standard Test Method for Rheological Properties of Paste Printing and Vehicles by the Falling-Rod Viscometer" is a test method that might work. For more, look her
Electronics Forum | Tue Nov 20 20:56:23 EST 2001 | davef
You�re correct. The release characteristics of epoxy differ from solder paste. Consider: * Using print/flood stroke, on-contact print cycle. * Printing slow enough to fill the hole with adhesive. * Overcoming the thixotropic [The viscosity of thixo
Electronics Forum | Wed Sep 01 06:38:37 EDT 2010 | grahamcooper22
Dear Leeg, Generally the faster your print speed the more down pressure you need on the blade to roll the paste and wipe the stencil surface clean. Pastes with higher viscosity need more pressure at slow and high print speeds. Too much pressure cause
Electronics Forum | Fri Sep 23 09:18:48 EDT 2011 | oswaldorey
Same happenend to me with another flux some years ago, to me its a reduced viscosity of the flux, what I did was to reduce the width of the slot on top, where the flux exits, reduced the distance from stone to pcb and filled the flux reservoir to the
