Electronics Forum | Wed Sep 01 06:38:37 EDT 2010 | grahamcooper22
Dear Leeg, Generally the faster your print speed the more down pressure you need on the blade to roll the paste and wipe the stencil surface clean. Pastes with higher viscosity need more pressure at slow and high print speeds. Too much pressure cause
Electronics Forum | Mon Aug 22 10:33:23 EDT 2005 | davef
Q1. What is recommended viscosity standard? A1: There is no standard. ASTM D4040-05 "Standard Test Method for Rheological Properties of Paste Printing and Vehicles by the Falling-Rod Viscometer" is a test method that might work. For more, look her
Electronics Forum | Mon Sep 17 15:27:51 EDT 2001 | jschake
Challenges: The basic defects that impact assembly yield are bridging, satellite solder balls, and opens (i.e. tombstones / draw bridges). There are many variables with the stencil printing process that can impact these; several of them are listed
Electronics Forum | Wed Oct 11 13:40:20 EDT 2023 | proceng1
Agreed. Your "leads" are fairly small compared to the PAD area, so you leave your part lots of room to "stretch it's legs". One thing that I have trouble communicating to my operators is that placement does not have to be perfect, and neither does t
Electronics Forum | Tue Sep 21 09:33:30 EDT 1999 | Scott Davies
| | | My stencil thickness is 6 mil and we got qfp's with fine pitch. | | | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | | | | | thanks | | | | | We use 6 mil lasercut stencils w
Electronics Forum | Wed Sep 22 21:12:16 EDT 1999 | se
| | | | My stencil thickness is 6 mil and we got qfp's with fine pitch. | | | | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | | | | | | | thanks | | | | | | | We use 6 mil lasercu
Electronics Forum | Tue Sep 21 08:49:59 EDT 1999 | Chad Notebaert
| | My stencil thickness is 6 mil and we got qfp's with fine pitch. | | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | | | thanks | | | We use 6 mil lasercut stencils with 15% redu
Electronics Forum | Tue Sep 21 17:24:58 EDT 1999 | John Thorup
| | | | My stencil thickness is 6 mil and we got qfp's with fine pitch. | | | | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | | | | | | | thanks | | | | | | | We use 6 mil lasercu
Electronics Forum | Wed Sep 22 22:23:55 EDT 1999 | SY
| | | | | My stencil thickness is 6 mil and we got qfp's with fine pitch. | | | | | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | | | | | | | | | thanks | | | | | | | | | We use 6
Electronics Forum | Fri Mar 19 05:08:24 EST 1999 | Vinesh Gandhi
Hey Marc, I am not sure about the kind of process you are following. Is it Gluing+paste printing on the bottom side or just gluing on the bottom side and paste printing on the top side. The relationship which I could think of between Bottom side
