Electronics Forum | Fri Jun 20 18:12:42 EDT 2003 | blundell
This is a very narrow view you have, X-Ray does not see all the problems that can occur, even with good rework gear or a sound reflow process it is still possible to get soldering defects, how do you know if you have a sound process to begin with if
Electronics Forum | Wed Jun 18 21:28:08 EDT 2003 | Larry D
Tom: Cheapest is grind flat spot on inspection mirror. Plastic mirror is easiest and works for the 1st 2 rows.
Electronics Forum | Thu Jun 19 13:39:47 EDT 2003 | Steve
So how much clearance between components (in mm) does the Ersascope require? What if you have caps around (2-3mm from the BGA's edge) a BGA . . . is it necessary to remove them prior to inspection of the BGA?
Electronics Forum | Thu Jun 12 03:41:47 EDT 2003 | sanjeevc
Most of the tools that are available in the market eg.ERSAscope or something similar gives a fair idea about the outside rows only and in case the defect happens in the inner layers all these tools are useless.The best way is to use AXI but then its
Electronics Forum | Thu Jun 12 14:52:24 EDT 2003 | russ
The supplier is METRON We use model M90-S Website http://www.metronusa.com phone - 858-755-4477 Russ
Electronics Forum | Thu Jun 19 19:27:33 EDT 2003 | Gary Miller
Mini Micro Stencil sells a mirror for $40.00. This thing is great and is made from metal so it won't break so easy. It is also only .008" thick. minimicrostencil.com
Electronics Forum | Tue Jul 01 14:28:29 EDT 2003 | rgustafson
I agree with the idea of having an outside company look at these parts. How can I find out who offers this type of service?
Electronics Forum | Mon Nov 25 18:43:29 EST 2013 | hegemon
Without the proper tools in house you will not be able to determine anything but the most obvious problems. At minimum, some side looking microscope that would allow visual inspection of a row or two, and to be able to rule out bridging. Using that
Electronics Forum | Thu Jun 12 11:12:08 EDT 2003 | babe
The last statement saying that seeing down the bga component with these systems is useless, is an incorrect statement. First with x-ray you do not see flux residue and or flux migration, second with x-ray you do not see a cold solder joint. Visual i
Electronics Forum | Wed Jun 11 18:22:41 EDT 2003 | Steve
Do you happen to know where I may find a supplier for the "little mirror"? Google didn't produce relevant search results for Mentor. My method of inspecting possible bridging under a BGA involved a small flashlight placed up against the edge of the
Our Company handle AOI (Auto Optical Inspection) and SPI (Solder Paste Inspection) Machines.
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