Electronics Forum | Thu Nov 19 14:38:49 EST 2009 | doremi
Oh, my dear, printer is just a part of the full picture. Without good and stable pick and place what if the printer is excellent???It is all important - printer, solder paste,stencil,P&P,oven,AOI and of course good process engineers or whatsoever are
Electronics Forum | Thu Apr 27 21:20:38 EDT 2000 | Dean
Here are some pointers to use during your X-ray inspection. Microcracking is virtually impossible to determine with X-ray. However, I suspect you are looking for "hard" opens. Those are much easier to find visually. If using a paste-and-place pro
Electronics Forum | Tue Jul 07 03:34:06 EDT 1998 | Martin Kelly
Hi just to let you know, in case you don't, but an x-ray machine is needed too check the solder balls, once they've been placed. See you later, | | I am very interesting of getting information about the criteria inspection of BGA. Example, what are
Electronics Forum | Thu Jun 19 10:47:29 EDT 2003 | Eric QE
Caltex or Ersa type system is good, Caltex prisms, necessary for looking underneath the BGA can be crashed easily when looking under low profile or Micros. $40-$110 each depending on the availability and who makes 'em. We have 2D and 3D X-ray avai
Electronics Forum | Thu Jun 12 11:12:08 EDT 2003 | babe
The last statement saying that seeing down the bga component with these systems is useless, is an incorrect statement. First with x-ray you do not see flux residue and or flux migration, second with x-ray you do not see a cold solder joint. Visual i
Electronics Forum | Mon Jun 23 04:00:43 EDT 2003 | Paul Cooper
Hi there There are a number of things worth considering when viewing bga's. Firstly, like any other solder joint that you have been inspecting for years, suface finish is critical. Secondly, and again like other joints shape is important. Now it may
Electronics Forum | Thu Dec 24 08:44:25 EST 1998 | Earl Moon
| | | | Folk's, | | | | I'm in need of some help / direction. I'm working on my thesis for a masters based on looking at the effect's of the solder resist promoting / reducing the amount of solder ball's during wave. I'm looking at thing's like colou
Electronics Forum | Fri Aug 02 18:30:45 EDT 2013 | hegemon
We use our Yestech and Mirtec to do that same thing. Verify the lead is in the hole and check the solder fillet. This is done as part of our normal solder inspection for mixed technology high runners. You may not be able to put together a program
Electronics Forum | Tue Feb 07 09:49:10 EST 2006 | George
Hello everybody, I have been asked to establish a way to improve our wave solder process. I wonder where I should start. We collect data by inspecting our PCB's visually. What's the best way to report data? Ocurrence of defects in total among all
Electronics Forum | Thu Apr 17 16:43:09 EDT 2003 | davef
Background: * Bulwith, Ronald A., �Failure Analysis of Solder Joints�, �Insulation/Circuits� magazine, February 1978 * Banks, Donald R., et al., �The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability�, Proceedings of the Technica
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