Electronics Forum | Mon Sep 19 07:56:19 EDT 2005 | Pop
How we can improved the Solder voids on QFN Packaging. Actually we adjust the time for solking to long . But is not affected. Pls advise. ThANK YOU
Electronics Forum | Sat Apr 15 14:28:26 EDT 2006 | Dan Mendoza
This may sound like advertasing, but I ran a DOE with five solder paste/flux manufacturers and somehow, the voids went away with the AIM solder.
Electronics Forum | Tue Jan 12 15:29:40 EST 2010 | davef
What is your concern regarding voiding in QFN solder connections?
Electronics Forum | Mon Sep 19 09:08:25 EDT 2005 | siverts
Search the SMTnet archives first. Ex. http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=8877&#Message35126
Electronics Forum | Tue Mar 03 14:07:07 EST 2009 | macisaint
I'm having shorts appear on my QFN packages between pins, usually only after a week or so of power-on operation. The shorts are 1K and slowly down to hard shorts over time. Typically a defective part will have failures on multiple pins. I tried havi
Electronics Forum | Mon Jan 11 13:31:54 EST 2010 | cbart
I know IPC is working on a spec for voiding for QFN'S. However since its not released I'm curious what others have defined as the max allowable % voiding on the leads (not center ground).
Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
Electronics Forum | Wed Feb 03 22:29:08 EST 2010 | mika
via apertures > solderding of terminals to the pads! That is zero which means => 90 % solderjoint Terminal to pad! http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=13914&#Message58952
Electronics Forum | Thu Jan 14 09:03:21 EST 2010 | cbart
I really don't have one, however our customers do. Since they see a spec in IPC for BGA's they have either addopted the 25% from the BGA spec or come up with their own. Also many have heard that IPC is working on defining critera. I was hoping othe
Electronics Forum | Sat Jun 05 13:38:22 EDT 2021 | ppcbs
For Linear Tech LGA's we solder bump the LGA using a .30mm solder ball then reflow with a tacky flux. This will provide a void free solder joint and adds a little height to the solder joint in case you use a flux that you want to clean from under th
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