Electronics Forum | Wed Oct 09 08:55:28 EDT 2002 | russ
okay, so how does the DRS remove voids from BGAs?
Electronics Forum | Thu Oct 10 16:13:01 EDT 2002 | slthomas
"Do you work for Air-Vac or what?" My question as well. If so, it is my opinion that there is a need for some house cleaning, because dissing a competitor's product on this forum is gutter-dweller tactics. If not, can you (AJ, not Russ) provide so
Electronics Forum | Mon Sep 30 09:00:26 EDT 2002 | arcandspark
Russ, I have been reworking BGA's for over five years now and have never been able to remove voids in the solder balls without removing the BGA itself. Your thermal profile can also cause the voids along with a poor solder paste. I have experimented
Electronics Forum | Fri Sep 27 15:30:28 EDT 2002 | russ
greetings all Does anybody have any methods or recomendations for removing/reducing excessive voiding in BGAs that are already on board? Had a bad lot of paste and I believe that we are seeing some opens due to very large voids. Any and all input
Electronics Forum | Tue Oct 08 09:51:10 EDT 2002 | larryk
Russ, I use the R562, it has a longer tack time then the Hm531 and have found no problems with voiding on my BGAs. You may want to evaluate this formula also Larry
Electronics Forum | Tue Oct 08 18:54:04 EDT 2002 | BobbyB
Hey Russell. The boys at Air-Vac Engineering can help you solve your problem. Are you using an DRS system. If not, you are probably out of luck and should scrap the boards. Cheers!
Electronics Forum | Wed Oct 09 17:44:46 EDT 2002 | alj
I guess you don't use one. Call them and I'm sure they will solve your problems and teach you a little bit about BGA rework profiling... CHEERS!
Electronics Forum | Sat Oct 19 11:48:39 EDT 2002 | davef
Good points, John. Continuing to track on the voiding issue, why remove voids anyhow? * Voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on at least on a temporary bas
Electronics Forum | Mon Oct 07 09:05:41 EDT 2002 | russ
thnaks everyone for the the input. I have been noticing that a lot of comments are referring to 230 deg. C and such. has something changed in the industry lately? It has been to my knowledge previously to peak the reflow at 215 or so. I have many B
Electronics Forum | Wed Oct 09 19:15:16 EDT 2002 | russ
Dave, so for example I need to peak at 203 and hold for 5-10 sec. This is my normal profiling procedure with the exception that I usually try to hit about 215C along with staying above liquidous for 60 secs or so. Something I was curious about was
