Electronics Forum | Thu Jan 02 22:09:15 EST 2020 | Zack
Hello, Can you give more detail on LGA parts in question? is 50 mm x 50 mm is overall size of the parts? What about pad pitch and how big is the pads individually? I assume that 50x50 mm is overall size. How about the stencil opening for the LGA pad
Electronics Forum | Thu Jun 10 16:42:11 EDT 2010 | daxman
Hi Muarty, We've had a lot of experience with QFN's now. Several years ago we started testing various design methods of the via arrays as well as paste apertures to cover the arrays. There has been some time that has passed now since these packages
Electronics Forum | Thu Jan 14 09:03:21 EST 2010 | cbart
I really don't have one, however our customers do. Since they see a spec in IPC for BGA's they have either addopted the 25% from the BGA spec or come up with their own. Also many have heard that IPC is working on defining critera. I was hoping othe
Electronics Forum | Mon Nov 11 10:57:03 EST 2002 | davef
Search the fine SMTnet Archives for background on voiding in BGA
Electronics Forum | Fri Jan 16 07:00:32 EST 2004 | mk
ssd eliminates voids from BGA's. Check out http://www.sipad.com
Electronics Forum | Mon Jan 13 16:23:29 EST 2003 | Eric Brown
Does anyone know of documentation that specifies whether or not voids in BGA solder joints hurt or help performance?
Electronics Forum | Tue Mar 09 17:52:05 EST 2004 | davef
Bryan: Comments are: * You're correct, solder paste formualtion is a major driver to voiding in BGA balls. * Voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on a temp
Electronics Forum | Sun May 08 07:09:04 EDT 2005 | Rick Iodice
We are continuing to struggle with voids under BGA's. Our problem are not consistent. some CCA's are perfect but others have pin hole sized voids. Does anyone have any feedback on Indium 92j and how it performs for bga's?
Electronics Forum | Thu Mar 02 04:44:48 EST 2006 | EC
Hi, We found voids on BGA. Understand IPC stated as long as not more than 25% should be fine. So, is there any standard stated how many voids in BGA can be allow. Appreciate your help......
