Electronics Forum | Thu Jun 18 12:43:45 EDT 2020 | emeto
I would say you check FAB drawing and see if there is any strange value on the stackup. Usually board house should inform you of these.
Electronics Forum | Fri Jun 19 03:17:45 EDT 2020 | rsatmech
We also don't inspect any things in incoming PCBs. We have CMM but will be used when we see any abnormality. Kindly advise me on this.
Electronics Forum | Tue Jun 30 10:25:37 EDT 2020 | rsatmech
Hi CPH, Thanks for your response. Sure I will share. But give me some time since we stopped SMT as of now. I will share you on 7/07/2020
Electronics Forum | Fri Jul 10 17:27:25 EDT 2020 | rsatmech
Hi, Image 1 - Solder short image Image 2 Same component X ray image Image 3 PCBA Solder short pad image (after removing the component) Image 4 Component pad image Image 5 PCBA pad image after tinning.
Electronics Forum | Fri Jul 31 19:02:03 EDT 2020 | rsatmech
We are currently running different make PCB and no such kind of solder short observed. Thank all for your valuable inputs. I have escalate the issue to supplier with alternative pcb validation report.
Electronics Forum | Tue Aug 04 11:14:54 EDT 2020 | rsatmech
Could you please enlight me on how to prove the issues by using RESIN PLUG HOLE method.
Electronics Forum | Tue Nov 20 12:48:40 EST 2001 | tony_sauve
We recently experienced a problem w/voids (up to 65%) in uBGA solder joints. The only joints that have the problem correlated to pads which had blind 0.006" via's in them. The via's only extend down 2 layers, of the 18. 21 BGA's on the PCB, only expe
Electronics Forum | Mon Nov 11 10:29:37 EST 2002 | Yannick
Hi, I'm beginnig working with BGA and with test I made I see some Void in it. I know that IPc have something on it. But I would appreciate if someone who have a good knowkledge about it contact me at: yb@m2s.ca Or can you give me some hint t
Electronics Forum | Wed Jul 08 00:12:20 EDT 2020 | duchoang
Interesting!. They don't look like voids as usual meanings. The "voids" take the whole size of pads. We built millions of BGA, never seen those before. Look like the pads refused to connect with solder paste and pushed the paste away. Pads contaminat
Electronics Forum | Thu Jan 30 07:09:34 EST 2020 | jineshjpr
Hi All, I'm using 8 zone reflow for ROHS 0.2mm Thick PCB soldering, but Micro BGA shows voids more than 25%. Is there anybody can suggest for better solder profile. paste- aim m8, SAC 305, T4, Soaking (150-200) - tried 90s, 60s, 45s; TAL (>217)-
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