Electronics Forum | Fri Nov 22 17:53:55 EST 2002 | davef
Search the fine SMTnet Archives for background discussion on BGA voids.
Electronics Forum | Sun Mar 07 19:53:38 EST 2004 | praveen
Hello, Voids in BGA can not be eliminated. You can only minimize them by reducing the solder paste volume. Try to bake the plastic BGA's and PCB both as per the standard. Check the PCB at the BGA locations if the via's are masked.Masked via's result
Electronics Forum | Mon Jun 14 12:22:24 EDT 2010 | chrisatae
What can I do to reduce BGA solder voids?
Electronics Forum | Thu Apr 23 22:01:07 EDT 2009 | davef
That you have one BGA of 30 BGA that has voids, makes us wonder what's the deal with that one BGA. Especially given that this is the initial run of a product with BGA at your plant, it really makes us want to understand just what is driving the voidi
Electronics Forum | Thu Jan 15 09:04:36 EST 2004 | rkevin
Does anyone have any information about eliminating voids on BGA using SN62 as opposed to the normal Sn63, something which explains the inter-metallic layers which form during the soldering process and the leaching out of silver ?
Electronics Forum | Mon Jan 13 18:22:55 EST 2003 | davef
100 sec) and decrease reflow temp to 205C. * Understand that voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on a temporary basis. There is no standard, IPC or otherw
Electronics Forum | Tue May 10 20:23:52 EDT 2005 | davef
Dr Lee at Indium has written extensively on voiding, Check their site for papers.
Electronics Forum | Sat Oct 19 11:48:39 EDT 2002 | davef
Good points, John. Continuing to track on the voiding issue, why remove voids anyhow? * Voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on at least on a temporary bas
Electronics Forum | Sun Mar 01 14:51:55 EST 1998 | Vincenzo Longobardo
From several months I am investigation about the VOIDS PERSENCE and his important as reliability. One question now is : It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? If you ha
Electronics Forum | Tue Nov 10 07:37:32 EST 2009 | scottp
I'm curious why your customer is concerned with BGA voiding. Normal process voids, even well in excess of IPC "limits", don't effect reliability so why monkey with the process to get rid of a non-issue?
