Electronics Forum | Fri Aug 06 10:27:05 EDT 1999 | Kenneth Hedman
| | I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? | | | | Thank you, |
Electronics Forum | Tue Jun 16 20:48:14 EDT 2020 | rsatmech
Point one -; I am also having this concern but based on the DPM it's getting difficult to keep the track to understand what exactly happened with the particular PCBA (Attrition component placed or Cleaned PCBA due to some issue those components are p
Electronics Forum | Fri Nov 13 08:27:43 EST 2009 | herman
Your customer is very unreasonable to demand void-free BGA SJs. Minor voiding is not a condition for rejection per IPC-A-610D, J-STD-001D, or even J-STD-001DS (Space addendum). Having said that, let me tell you that the voiding has little or nothing
Electronics Forum | Mon Apr 12 08:10:17 EDT 2004 | wgaffubar
We are sometimes, not always, seeing very large voids in the solder joints of BGA's with Via in Pad. Some lots of PCB will have the voids and other lots of boards will not. I feel the via's are outgassing during reflow, due to the PCB not having been
Electronics Forum | Tue Mar 09 22:13:20 EST 2004 | Ken
What x-ray system are you using? Check out Dage. I bet you have voids...just can't image them. Why the fuss over voids? Voids terminate the crack propegation and can extend the time to failure for creep fatigue. I would not be concerned unless yo
Electronics Forum | Tue Mar 28 14:20:37 EST 2000 | Reggie Malli
Hello there, Is there a microBGA qualification procedure available somewhere? Does anybody have any experience with X-ray laminography, if so, what are the benefits of laminography versus the standard x-ray? Can somebody point out the study about th
Electronics Forum | Thu Jan 14 23:49:00 EST 1999 | Wirat Sriamonkitkul
I saw the problem of void in solder bump or in lead less component or some BGA. But I didn't have standard specification of that void is accept or reject? Do any body have the better idea or suggestion of the criteria ? Thank you, Wirat S. / Jan 15
Electronics Forum | Fri Sep 27 15:30:28 EDT 2002 | russ
greetings all Does anybody have any methods or recomendations for removing/reducing excessive voiding in BGAs that are already on board? Had a bad lot of paste and I believe that we are seeing some opens due to very large voids. Any and all input
Electronics Forum | Tue Oct 17 09:27:23 EDT 2006 | SWAG
We had a build that showed a relatively high occurence of BGA voids like you were seeing. It was a very small volume first article that took a long time to get through the line so the paste sat on the boards too long. As we ramped up TACT time in p
Electronics Forum | Wed Mar 29 09:39:45 EST 2000 | JAX
Garo, Minor voiding in Ball Grid Array solder joints is common, and not considered a threat to reliability. The biggest cause of open solder joints caused by voids is the outgassing of moisture. They are formed when pockets of gas are trapped durin
