Electronics Forum | Tue Oct 10 04:10:43 EDT 2000 | Tanu
Hi, Jacko is right!BGA ispection equipment like Xrays are extream expensive if you want a good system. There is some xrays that you can have low cost but if you are planning to do superBGA�s or want better image you need atleast 80-100Kv with good r
Electronics Forum | Fri Mar 05 22:49:42 EST 2004 | Bryan She
Hello all, recently,I met a voiding issue in board to BGA ball joints. I've checked so many threads in this forum,but I can't find one which is really useful perhaps.Is there anyone who also met this issue,and then,in the end, succesfully get rid of
Electronics Forum | Fri Jun 16 11:37:15 EDT 2006 | docker
I�m working in Solder paste manufacturing industry and my customer has complained the void issue on BGA pad. I�m internally conducting the void test on BGA pad in my Lab. I used OSP furnish board with Sn/Pb and /or lead free component using Lead free
Electronics Forum | Thu Jul 15 12:02:38 EDT 2004 | Yngwie
We have massive void problems on one of the BGA populated on the bottom side of the board. The board have 6 BGAs on the top and 1 on the bottom. No voids were observed during the first reflow (we reflowed bottom side first), but after the second refl
Electronics Forum | Fri Jul 16 03:35:34 EDT 2004 | Yngwie
We have massive void problems on one of the BGA populated on the bottom side of the board. The board have 6 BGAs on the top and 1 on the bottom. No voids were observed during the first reflow (we reflowed bottom side first), but after the second refl
Electronics Forum | Wed Nov 24 19:32:06 EST 2004 | Dreamsniper
Hi, Has anyone done this? X-ray a populated PCB and found voids on chips and some IC solder joints? Is this kind of screening acceptable? I got a PCB with this problem and not ruling out paste, profile and contamination issues. Please Help as it see
Electronics Forum | Fri Jun 17 23:31:12 EDT 2005 | kenscj
Hi all, currently, we are seeing BGA problem like solder ball misalign, void, solder short (all under BGA, tested with 5DX), after reflow. We examine the solder ball (raw material of BGA), and see that the ball surface is not smooth, will that affe
Electronics Forum | Tue Jun 26 16:07:12 EDT 2018 | eduszapata29
Minami vacuum reflow is easy to maintain air tightness, and oxygen can be reduced to 50ppm or less by filling N2 gas. And generation of oxide film can be suppressed, and production in low oxygen environment is possible. In addition to the air tightne
Electronics Forum | Mon May 05 11:48:33 EDT 2003 | mk
We have had good luck with via in pads using solid solder deposition. Please contact me off line or provide a number I can call. Thanks Matt Kehoe m.j.kehoe@att.net
Electronics Forum | Tue Oct 08 18:54:04 EDT 2002 | BobbyB
Hey Russell. The boys at Air-Vac Engineering can help you solve your problem. Are you using an DRS system. If not, you are probably out of luck and should scrap the boards. Cheers!
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