Electronics Forum | Wed Jan 15 23:32:36 EST 2003 | tinson
How about section 12.2.12 of IPC-A-610C? It doesn't include detailed description of root cause/effect but acceptance criteria.
Electronics Forum | Wed Jan 12 17:47:13 EST 2005 | Dreamsniper
I wanna make a MSExcel spreadsheet that will automatically convert Percent Area of a BGA void to Percent Diameter. What is the formula? Thanks and regards,
Electronics Forum | Tue May 02 07:56:58 EDT 2006 | billyd
Yeah, that's what I'm doing now. I have it now peaking around 235, with about 70 sec. above 220C. (220C is the reflow temp, according to manufacturer. I've always used 217C for Pb free) Wish me luck. Thanks!
Electronics Forum | Wed Jun 06 03:07:01 EDT 2007 | golff
Hi all, I am new on Xray technology. Can anyone give a idea about the void on the BGA? How are those happened and how can i detect it? Is it any article or link recommend? Thanks!!!
Electronics Forum | Mon Feb 11 21:57:12 EST 2008 | davef
While you're waiting for others to reply, search the fine SMTnet Archives to find things like http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=41292
Electronics Forum | Fri Jun 04 08:33:44 EDT 2010 | karthikthebest
Hi, Just have a look at the tech sheet on VIP, looks likes a continuing story until IPC defines the criteria in a better way
Electronics Forum | Wed Jun 06 11:19:21 EDT 2007 | ramseyn
Hello. What kind of void are you seeing? You said the part was a BGA, is it being underfilled or is it a solder void?
Electronics Forum | Fri Feb 25 16:04:18 EST 2000 | Dave F
Sze-Pei: Are talking BGAs here? Flux type? Profile? Pad material? Aperture size? We won�t want to give people too many hints on what the problem is would we? BGA voiding is a function of materials, methods, environment, and human factors. Con
Electronics Forum | Fri Feb 25 16:04:18 EST 2000 | Dave F
Sze-Pei: Are talking BGAs here? Flux type? Profile? Pad material? Aperture size? We won�t want to give people too many hints on what the problem is would we? BGA voiding is a function of materials, methods, environment, and human factors. Con
Electronics Forum | Tue Jan 18 12:44:24 EST 2000 | Russ
I have found that reducing the amount of metal in the joint makes a difference, we have reduced the aperture sizes to provide a minimal amount of paste. just enough to hold the part during handling. You may also want to try and slow the initial ram
