Electronics Forum | Thu Sep 02 07:50:27 EDT 2010 | sachu_70
Just to add to my comments,solder joint voids do occur in LGA. Voids in LGA can be larger due to geometry and greater ratio of flux to solder. IPC-A-610D specifies a greater than 25% voided area is a defect for BGA, however, it does not specify the d
Electronics Forum | Sun Nov 28 03:27:03 EST 2004 | jmedernach
Hi Guy, I see them frequently. Usually, if I have voids on my BGA's, I'll have them on my passives as well as at leaded device solder joints. They run rampant through the entire assembly. For me, it's a function of my profile. I only have a 4 zon
Electronics Forum | Tue Feb 12 18:48:48 EST 2008 | larryd
Thanks for the spare change. Questions are good and I did miss one item. Process has 100% solder paste inspection with a 3D inspection machine that has very few false calls or accepts. Ramp to peak is less than 1.5C/sec. Profile looks good, solder
Electronics Forum | Sat Mar 06 06:15:14 EST 2004 | Bryan
Thanks Tommy. In fact I've tried many types of profile,but it didn't work.I'll try to make the peak temp. as low as 205C and dwell long as in some threads Dave said.I've tried baking the BGA and PCB before mounting also dindn't work.yes,I've heard th
Electronics Forum | Mon May 25 08:37:28 EDT 2009 | d0min0
Hello, recently we changed supplier of the LF BGA, we did corossection and now have doubts... previous BGA specs : pitch 1mm, ball diameter 0.6mm future BGA specs : pitch 1mm, ball diameter 0.4mm on the crossecrion we found that one of the ball seem
Electronics Forum | Fri Nov 13 06:56:37 EST 2009 | CL
Good Morning, The customer is looking for void free connections. They had never specified an acceptable percentage. We are reacting to the test yield. Our yield has averaged 50%. We do not test the product so we rely on feeback from the customer. Us
Electronics Forum | Mon Jan 22 20:54:55 EST 2001 | davef
IPC-7095 - Design & Assembly Process Implementation for BGA's Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. This document
Electronics Forum | Wed Jan 14 23:08:19 EST 1998 | Ron Costa
Place your components directly on the PCB without using solder paste,unless your using high temp. solder spheres then you should use paste. If eutectic solder spheres are used try fluxing the BGA area and attach it directly to the board. This will re
Electronics Forum | Tue Jun 02 21:27:22 EDT 2009 | davef
We've never heard of a situtation where oversized pads caused voiding. Your supplier is correct that the pads on the board should be the same size as the pads on the interposer, but this is to improve reliability issues. Search the fine SMTnet Archi
Electronics Forum | Wed Oct 09 19:08:37 EDT 2002 | russ
AJ, I have bought and used 2 DRS24's in the past. It is a good machine. (I don't think that I will bring up the fact that a certain package that I had kept shorting so I sent them a couple to help with the profile and all of them came back shorted
