Electronics Forum | Mon Sep 17 19:33:27 EDT 2007 | davef
We have never studied this, but here's what we'd guess. If there are void in BGA solder balls at inbound: * A proper reflow recipe will eliminate the void. * A poor recipe will allow the void to remain and possibly generate additional void.
Electronics Forum | Mon Feb 11 17:21:40 EST 2008 | larryd
What causes BGA voids over 25%? Have recommended profile for solder paste, hit 237C for 5 seconds and still get a void on 2% of specific BGA in various locations. BGA is FG676, 1mm pitch, on ImAg using lead free paste OM338 on a 6 layer FR4 PCB.
Electronics Forum | Thu May 03 17:34:57 EDT 2001 | oscar mendez
Does any one experienced problems on BGA voids related to height of chip (placement), and also another question, Does any one has some statistical process control for the BGA soldering process? if the answer is yes, I'd like to have advice from you.
Electronics Forum | Fri Nov 12 09:08:54 EST 1999 | mart weakley
Has anyone put together all the key parameters/drivers for voids on high density BGA's?? Thanks, Mart Weakley
Electronics Forum | Sat Mar 06 02:54:25 EST 2004 | tommy
1)Solder paste selection 2)Reflow profile.Focus on soaking and TAL. 3)Moisture control for BGA. 4)Maybe the BGA solder ball already with void. 5)PCB design.Any via on bga land? 6)Solder masking type. 7)Solder paste volume apply on land. 8)IPC class 3
Electronics Forum | Tue Nov 10 12:23:38 EST 2009 | CL
Good Morning, I agree. This has been a problem job for us. They are looking for anything that could be implicated. Right now, they are focusing on the profile. My question pertains to the frequency of micro voiding on BGA devices. I have seen some
Electronics Forum | Mon Nov 16 03:31:22 EST 2009 | cunningham
I suggest you X-Ray the devices before you place them on the board we have just foun a large amount of voids on the BGA before its even placed
Electronics Forum | Mon Jan 17 18:36:26 EST 2000 | William
Voids can be acceptable @ 24% per 5 balls area, and 8% per single ball area. In fact, Proceeding Book 1996; Vol. I, Page #126 conclusions saids: that solder joint voiding at the maximun levels pbserved in this study (were voided area was up to 24 per
Electronics Forum | Thu May 20 14:38:09 EDT 2010 | davef
Unfilled vias consistently produce higher quantities and larger voids than filled vias, in some cases 5 times as much. [Effect of Filling Via-in-Pad on Voiding Rates in PWB Assembly for BGA Components; C Shea, R Raut, L Piccione; ALPHA -A Cookson Ele
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