Electronics Forum | Thu Apr 23 15:46:08 EDT 2009 | ccross
During initial profiling we shoot for 15% or less voiding on our BGAs. During production runs we consider voids under 15% to be ok. Voiding between 15%-25% we string tag and pay more attention to during test. Over 25% we consider a reject.
Electronics Forum | Thu Aug 23 00:17:53 EDT 2001 | mugen
Mike, 1) NC process = less BGA voids & void-size 2) longer soak times... Heyz, thanks mate :) ~~~~~~~~~~~~~~ Dave F, tot u were inclinded to the school of thought, that NC process hath higher chance for whining abt voids?
Electronics Forum | Mon Jan 22 21:30:41 EST 2001 | dason_c
I had my experience when I run the Motorola BGA and I am not sure the voiding was created due to the incompatible flux residue. Rgds. Dason.
Electronics Forum | Mon Sep 30 09:26:04 EDT 2002 | itempea
Russ, first step would be to get IPC-7095 on BGAs. A few notes: There can be voids in solder balls, or at the solder joints to the BGA, or at the solder joints to the PCB. Various sources or reasons can be responsible for these voids. Voids can be
Electronics Forum | Mon Mar 27 20:59:41 EST 2000 | Dave F
Garo: Voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on a temporary basis. There is no standard, IPC or otherwise, on voids--nor should there be. See also J-STD-013,
Electronics Forum | Mon Mar 27 19:29:14 EST 2000 | Garo Donabedian
I ran six boards with uBGA, and all six have voids 25-30%. I would like to know what would cause this since this is my first time running into this problem. also I would like to know how does a void effect the components function the customer does no
Electronics Forum | Sun Mar 07 17:53:39 EST 2004 | Ken
Increasing the metals loading may help. But may cause issues elsewhere. Unsure of your exact process....but may work. Is anyone dispensing solder paste onto BGA pads...how is voiding in comparison???
Electronics Forum | Mon Oct 21 03:52:38 EDT 2002 | Ben
I'm doing lead-free SMT of BGA with 450 micron ball. I found there are lots of voids under xray, there are around 2-3 voids in every balls. It is around 10% of volume ratio. I would like to ask if anyone know there is any standard of acceptable maxim
Electronics Forum | Tue Jun 16 19:41:46 EDT 2020 | emeto
Voids form mainly two ways. 1. Contamination - due PCB pads/part leads oxidation, wetting on the pad is bad forming void(these are usually borders with SMT pad - peripheral) 2. Process formed. These are in the center of the solder joint - could n
Electronics Forum | Mon Nov 26 20:41:24 EST 2001 | davef
Which ramp is this? * Ramp to preheat? * Preheat? * Ramp to spike?
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