Electronics Forum | Wed Oct 23 14:44:58 EDT 2002 | mzaboogie
Hi Ben, IPC610 has a pass/fail of 25% of ball volume. Hope this helps
Electronics Forum | Fri Apr 24 06:16:50 EDT 2009 | naguiar
CHANGE SOLDER PASTE, AND ADJUST PROFILES. Nolasco
Electronics Forum | Mon Nov 16 13:33:31 EST 2009 | CL
Thank you for your responces. Chris
Electronics Forum | Thu May 20 12:21:33 EDT 2010 | scottp
Since they don't effect the functionality or reliability of the product, I'd just ignore them.
Electronics Forum | Mon May 09 14:36:49 EDT 2005 | driscolj
We've had similar problems with Indium 6.2 water soluble paste. We reduced our voiding by implementing a longer soak and lower peak temperature.
Electronics Forum | Thu Mar 02 07:57:25 EST 2006 | davef
Voids in BGA most often are a process indicator, you know unless either they're huge or there's lots of them.
Electronics Forum | Tue Jun 30 09:59:44 EDT 2020 | cph4w
Hi SRINI, Are you able to show X-ray of these 2 locations from other board w/o bridging? Void looks almost perfect circle which I never encountered before.
Electronics Forum | Fri Aug 16 09:59:49 EDT 2002 | dason_c
We baked the board first and print 2 mil water soluble paste at the BGA location and reflow. Wash and baked before the production run.
Electronics Forum | Sat Jul 11 03:01:29 EDT 2020 | researchmfg
The bubble inside BGA ball locate at via in pad and apply the resin plug hole.You shall check the cooper plating quality on PCB pad. If there is thin plating or broken on the pad then air will come from the resin plugged via and be trapped inside the
Electronics Forum | Sun Mar 01 15:52:13 EST 1998 | Earl Moon
| From several months I am investigation about the VOIDS PERSENCE and his important as reliability. | One question now is : | It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? | I
