Electronics Forum | Mon Jan 22 22:37:27 EST 2001 | davef
50 ppm oxygen was on half joints reflowed in air. 3d Human factors PCB pad cleanliness: Handling of bare board pads creates excessive voiding. Print rejection: Cleaning of OSP pads with acetone or isopropanol increases voiding.
Electronics Forum | Wed Feb 09 06:35:18 EST 2000 | Mark Williams
Hi We use 2 criteria... maximum void size is 10% of the solderable surface and a maximum area of voids of 10% of the maximum cross-sectional area of the ball. Any views Mark
Electronics Forum | Mon Oct 21 09:09:54 EDT 2002 | Ben
thanks for ur help. i would also like to know the classes is for showing different level of requirement, or for different vertical location of void in joint. coz I heard from my workmate that the range from 9% to 36% is for void at different vertical
Electronics Forum | Fri Nov 13 01:45:35 EST 2009 | hallwayit
Could you clear how much void content do you client required? Normally, 5% void content is permited in clients.
Electronics Forum | Thu Nov 21 08:20:32 EST 2019 | scotceltic
Ok, Question for all of you quality inspectors out there. Would you consider the IC image here to have excessive voiding given the amount of vias ? I only see an IPC voiding spec on BGA balls but nothing for IC's. I'd appreciate all your thoughts
Electronics Forum | Wed Jan 19 00:42:09 EST 2000 | park kyung sam
In my case, when i solderd the bga in normal reflow(convection hot air). There is a lot of boid. i had tried to reduce void long time. so i reduced just a little. It did't satisfied me but now i cannot looking for the void in soldered bga i
Electronics Forum | Thu Aug 15 15:58:12 EDT 2002 | robertnguyen
To whom this may concern, I recently ran into the problem with vias on pads of BGA when place BGA and reflow gas trap on vias escape and result in ball having void greater than 50% of BGA diameter. The BGA pad is measured at 20 mils and the vias mea
Electronics Forum | Sun Dec 28 05:31:59 EST 1997 | Bob Willis
We have a x ray inspection criteria video and poster set which may be of interest check out our home page www.bobwillis.co.uk | | I'd like someone gives me a tip for elemating of voids | | in the mico BGA solder joint and the method of inspection |
Electronics Forum | Thu May 20 21:16:46 EDT 2010 | erli
Hi Pat According IPC-610D voids biger 25% are considered defects. You need verify you Pre Heat and try to reduce the ramp. Its very importante verify if the BGA`s are avoid hummity. Erli
Electronics Forum | Tue Apr 13 09:46:39 EDT 2004 | davef
Now, that's different. We misunderstood the problem from your original descrtiption. We thought the voids were showing at the via in the pad. Now, we understand the voids appear to be in the solder balls. Suggestions are: * Search the SMTnet Arch
