Electronics Forum | Thu Apr 23 07:51:45 EDT 2009 | scottp
Every paper I've seen published shows that BGA voids either have no effect or actually give a slight improvement. The one exception are voids with a root cause in bad incoming boards, such as champagne voiding where nearly the entire interface is go
Electronics Forum | Tue Nov 26 09:07:16 EST 2019 | scotceltic
I am more worried about those voids also instead of the voids in the thermal pads. I still can't find any IPC spec that calls out a min. void percentage other than on BGA packages.
Electronics Forum | Tue Feb 12 04:07:29 EST 2008 | aj
Hi, Have you checked out the BGA datasheet and see what profile is recommended for the BGA ? I use OM338 and there are dozens of recommended profiles for the Paste but you have to consider the components aswell. You state your Peak temp which I w
Electronics Forum | Tue Jun 16 17:51:49 EDT 2020 | emeto
Your statement is interesting, but not necessarily correct. Are shorts in the same location? Is it one short or multiple? Are there any vias in the BGA pads on the PCB? Is part MSD and handled as ESD?
Electronics Forum | Wed Jul 08 02:50:30 EDT 2020 | rsatmech
Hi DucHoang, Thanks for the response. I will share the images. We are using OSP boards and issue is not at particular BGA. Can you suggest me any methods to identify the pad contamination.
Electronics Forum | Thu Mar 30 21:46:56 EST 2000 | Dave F
Reg: This is copy / paste from draft version of IPC 7095 ( issued May 1999 ) ... 7.3 Assembly accept/reject criteria 7.3.1 Voids in solder joint a. Sources of Voids There can be voids in solder balls, or at the solder joints to the BGA, or at the so
Electronics Forum | Wed Feb 02 21:56:11 EST 2005 | davef
Based on X-ray imaging, IPC-7095 standard specifies three categories for void size for BGA solder joints. These categories are based on the percentage of joint cross sectional area occupied by the voided area. Class III Small: Void area is LT 9% Cla
Electronics Forum | Fri May 21 15:36:54 EDT 2010 | pforister
Erli, Thanks for your feedback. The BGA hybrids were baked before production. I had a particular date code that we dis-continued using. This date code was consistently voiding near or above 25%. The other date codes still produced voiding on ave
Electronics Forum | Tue Jul 26 08:20:46 EDT 2005 | Bob R.
All you can do is try it. I did a literature search last year on causes of BGA voiding and came up with a pretty long list, sometimes contradictory. I also discussed it with several paste suppliers. What I came away with is that what aggravates voi
Electronics Forum | Tue Jul 22 06:41:40 EDT 2003 | davef
bga void doe * Dr. Lee at Indium Corp. has conducted a number of investigations concerning solder joint voiding and BGA components. Check Indium's site. [As an aside, Lee's book "Reflow Soldering Processing and Troubleshooting SMT, BGA, CSP and Flip
