Electronics Forum | Wed Feb 20 09:05:38 EST 2008 | tonyamenson
We had a similar problem with lead-free through-hole components. We baked those baords to remove the residual moisture and everything went to 100% pass - defect was gone. Couldnt hurt to try a sample run while you decide if the PCB holes need to be
Electronics Forum | Wed Feb 20 12:22:14 EST 2008 | tonyamenson
iv40, I don't suppose you know/remember what base material you were using that caused the problem and what material you switched to was, do you? We just pre-bake all our lead free PCBs as a precuation but I would like to remove the process if I can
Electronics Forum | Tue May 02 07:19:29 EDT 2006 | billyd
Good morning all. I'm trying to find some help on my voiding issue on my lead free BGAs. I am using a Heller 8/2 zone oven, and using Qualitek solder paste. I had listened to a tech representing another solder company, who told me to make the joints
Electronics Forum | Tue Feb 19 22:57:38 EST 2008 | davef
Duno. What's the diameter of: * Finished connector lead * Finished through hole We reckon: Lead size plus ~0.25mm [0.010"] is normal.
Electronics Forum | Sun Aug 19 15:34:20 EDT 2007 | davef
What are you trying to do: * Improve hole fill? * Reduce PTH voiding? Hole fill: Search the fine SMTnet Archives for stuff like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=36063 PTH voiding: Ideally, there are no voids. We're unawar
Electronics Forum | Mon Mar 12 08:27:00 EDT 2007 | rgduval
Have you checked the parts for contamination? Are the voids out of spec? IPC allows some voiding, especially with lead free solder. Component contamination can cause this to repeat, as well. Try pre-tinning the component in question, and see if s
Electronics Forum | Mon Jan 25 13:42:35 EST 2010 | patrickbruneel
This is a post from another forum as a response from Bob Landman to a claim that he had no evidence to be concerned about lead-free in hirel applications (interesting read). See below and am sure many technetters will find this interesting **********
Electronics Forum | Mon Jul 16 10:51:09 EDT 2007 | patrickbruneel
D. Hillman, et al., �The Impact of Reflowing a Pb free Solder Alloy Using a Tin/Lead Solder Alloy Reflow Profile on Solder Joint Integrity,� International Conference on Lead-free Soldering, CMAP, Toronto, Ontario, Canada, May 24-26, 2005, http://www.
Electronics Forum | Mon Jul 16 10:17:22 EDT 2007 | realchunks
Yes you can use no-lead parts in a leaded process. Your solder joints will be weaker than they once were unless you change your solder paste. You can try to improve this by running a hotter reflow temp, but be careful since your flux was not design
Electronics Forum | Fri Jul 20 11:48:22 EDT 2007 | muse95
I agree with Chris. Not all but SOME components definitely had to change to be able to withstand higher heat. I would watch out for some plastic connectors, possibly some active components, and definitely many electrolytic caps. Older stock compone
