Electronics Forum: wafers (Page 1 of 8)

Vertec probes for wafers testing

Electronics Forum | Fri Nov 10 12:22:12 EST 2000 | casi

I'm interested in probes for wafer testing made in verted. I need to tested wafers with pad with flat gold bumps ( 17um ) with pitch = 70um. I'm also interested in every web site related on gold bumps testing. Thanks a lot !!! Casi

Testing and probe contact for wafers with bump

Electronics Forum | Mon Jun 05 05:41:48 EDT 2000 | casi

I need to find info about testing and probe contact about wifers with bump on pads. Thanks a lot to everybody that helps me

Wafer Reflow Profile

Electronics Forum | Mon Feb 01 18:08:10 EST 1999 | Susan

Hello Everybody: I am in urgent need of some information regarding the reflow profile for a flip chip wafer. Would the reflow conditions along with the flux used affect the appearence of the solder joints. We are witnessing dull solder joints afte

Re: wafer to waffle

Electronics Forum | Tue Sep 12 03:36:50 EDT 2000 | PeterB

I have just read that Hover-Davis now manufacture a direct die feeder which can feed directly from wafer to P & P machine compatible with a number of different placement machine manufacturers. Perhaps this will help? Best regards

Quad Laurier Die Feeder?

Electronics Forum | Tue Feb 06 21:11:27 EST 2001 | Frank

Does anyone know if the Quad ASP machine uses a die wafer feeder manufactured by Laurier. I have experience with the Laurier wafer die handlers and thik they really work well. I am thinking about Quad ASP for a flip chip placement machine. Thanks,

Re: Wafer Reflow Profile

Electronics Forum | Tue Feb 02 08:37:32 EST 1999 | Chris G.

| Hello Everybody: | | I am in urgent need of some information regarding the reflow profile for a flip chip wafer. Would the reflow conditions along with the flux used affect the appearence of the solder joints. | | We are witnessing dull solder j

Re: wafer to waffle

Electronics Forum | Wed Sep 13 07:17:32 EDT 2000 | Paul Gerits

Dear Sir, It is possible depending on the exact application. At the moment only way to go direct from die to waffle or PCB is with Hover Davies direct die feeders on Philips EMT (ACM, advanced component mounter), Universal and Siemens machines. This

Reflow profile for Sn50/Pb50 solder paste

Electronics Forum | Tue Jul 15 21:04:17 EDT 2003 | Thomas

It is for an evaluation run for wafer bumping....Well guys any recommendation for the profile ??

queations about the production of semiconductor component, including wafer IC decrete device

Electronics Forum | Tue Dec 03 16:35:15 EST 2019 | slthomas

:poop: Rats. Just checking.

Viking Wafer Map Format

Electronics Forum | Fri Nov 13 17:59:08 EST 2020 | stevedb321

Thanks! Dave Steve DB

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