Electronics Forum | Thu May 18 07:37:06 EDT 2017 | stephendo
I have just been asked to project manage the > introduction of new production line within my > organisation . This normally wouldn't be a > problem but I have very little experience on smt > manufacturing. I guess the hard part is done as > all
Electronics Forum | Tue Apr 02 07:12:38 EDT 2019 | jchris
I worked with a PACE TF1800 for about a month on a project last year and it performed flawlessly for BGA and QFN installations and removals. It can handle boards up to 12"x12". Really easy to use with excellent profiling software that walks you throu
Electronics Forum | Fri Oct 13 17:21:05 EDT 2000 | Jason Nipper
A few weeks back we experienced a wave process problem where we received deposits on our pcb. At first we though it was dedrites but after an outside analysis of the deposits they were found to be tin. We have tried to remove the deposits with brus
Electronics Forum | Wed Jul 10 18:19:42 EDT 2002 | davef
Flex cracking under the terminations is generally regarded as one of the primary causes of failure of ceramic chips. If you can see cracks in the solder joints from board flex, those chips are certainly strongly suspect, and you must assume there is
Electronics Forum | Thu Sep 14 19:19:38 EDT 2006 | SWAG
I would try to panelize as big as you can for sure as you'll spend more time handling single boards than running anything. Additionally, this size is very close to smallest capabilities on GSM depending on your configuration. Fids on all boards in
Electronics Forum | Sun Feb 04 15:06:20 EST 2007 | Scotty
Profile should have a longer cool soak. Verify as was mentioned all pin/fixture support through out the entire process. Print, Place, pre reflow hand load, post reflow, carriers, ICT, Depanel and FCT. Conformal Coated or Potted? Mylars work well for
Electronics Forum | Wed Oct 06 08:49:22 EDT 1999 | Mark
| | I hope that someone can help me with my problem! I am experiencing a lot of glued on parts falling off in the wave solder machine. A little information about my process: 1)We use Loctite 3609 glue that is used up long before its shelf life 2)Ou
Electronics Forum | Wed Oct 06 11:41:50 EDT 1999 | Bill Haynes
| | I hope that someone can help me with my problem! I am experiencing a lot of glued on parts falling off in the wave solder machine. A little information about my process: 1)We use Loctite 3609 glue that is used up long before its shelf life 2)Ou
Electronics Forum | Tue May 18 16:48:49 EDT 1999 | Tony
| | | | | What is the best way to re-ball a BGA? Who has the best system for doing it? | | | | | | | | | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard mi
Electronics Forum | Thu Feb 10 13:54:22 EST 2000 | Kris W
Hi All, We are in the process of converting from RMA solder paste to no-clean process across the shop. This will allow me to carry my semi-aqueous cleaner out of the building and set it ablaze using the terpenes as the fire water. Then I can go ab
