Electronics Forum | Thu Nov 15 08:25:08 EST 2007 | rgduval
I do think that the designer goofed, and used too large vias. I believe he only used on size via on the entire board, regardless of whether it was in a pad, or out on the board. I have seen vias in pad work, though. From a manufacturing standpoint
Electronics Forum | Wed Nov 07 10:30:19 EST 2007 | grantp
Hi, I did an interesting experiment today, when we had some government people in our factory to visit us. I mentioned that we went lead free well before the deadline, and it's nice none of our people need to handle anything with lead content, (they
Electronics Forum | Tue Dec 11 17:04:33 EST 2007 | pgarsoe
We want to start a discussion on the solar manufacturing market in response to a conversation with Anita Brown of Indium at the recent Productronica show in Germany. Since we referred to it in our show report newsletter we decided to start a thread a
Electronics Forum | Mon Dec 17 08:58:21 EST 2007 | Frank
You can spend a couple grand on a manual screen printer, or do what I did back in the day: place the board on the work bench and lay the stencil on the board. If you can hold it steady enough you can use a putty knife to apply your paste. For the s
Electronics Forum | Wed Dec 19 22:32:03 EST 2007 | davef
Nerdyboy don't write no blanking program. Get two extra carriers of the same size and configuration as the low temperature carrier that you want bake at a higher temperature. One of the these extra carriers needs to be high temperature material that
Electronics Forum | Fri Dec 21 09:20:36 EST 2007 | operator
Hello All, I read AIMs article "Time Above Liquidus". It was very informative and a good read. One thing that the article didn't touch on, that is a mystery to me, is thermal shock to components during the ramp up stage of a profile. If you
Electronics Forum | Wed Jan 30 14:11:15 EST 2008 | slthomas
We dodged it for a while but it was inevitable. Here's the question. What do I REALLY need, and does anyone even agree on it? OK, that's *two* questions. The first board we're likely to do has three parts that will need special consideration. One
Electronics Forum | Tue Mar 04 08:56:38 EST 2008 | tonyamenson
I talked to a solder paste chemsist and found out a few things. From above (Dave F) states a test for solder paste involving reflow on a non-wettable surface. Commonly known as the solder ball test this test is performed all the time by paste manufa
Electronics Forum | Wed Mar 12 13:16:42 EDT 2008 | ipdisplays
Hi All, I know some of this has been covered - but nothing recent that I could find - so please bear with me... Seems like the used/refurb market is kind of fluid so would like some current thoughts.... I'm looking to setup an inexpensive prototype
Electronics Forum | Tue Mar 18 11:52:38 EDT 2008 | rrpowers
A couple years back we were looking at going to an enclosed solder paste printing process, similar to the ProFlow, Crossflow, or Rheometric Pump. We have older MPM AP25's with a custom transport. Speedline told us that in order to add the RheoPump,
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