Electronics Forum | Thu Nov 01 17:36:20 EST 2001 | davef
We don�t bake between routine washing between soldering cycles. We bake when we immediately go to test or box-build. Certainly, it all depends on your process, materials, and boards. So, how did you determine that you needed to spend the money? I
Electronics Forum | Fri Aug 16 09:59:49 EDT 2002 | dason_c
We baked the board first and print 2 mil water soluble paste at the BGA location and reflow. Wash and baked before the production run.
Electronics Forum | Mon Dec 01 14:51:55 EST 2014 | jpal
We had the same problem too. Water would remain under the caps even after a bake out. We saw this numerous times when the caps were removed after the wash and bake. The only fix was to hand solder the large electrolytics.
Electronics Forum | Thu Nov 01 01:48:14 EST 2001 | hamos_wks
168hrs, 1week of storage and frequently applied for rework after testing.
Electronics Forum | Wed Dec 03 08:39:09 EST 2008 | sys_steven
boards are polyimide, and it is an ipa rinse with the solvent cleaner.
Electronics Forum | Tue Oct 30 21:42:32 EST 2001 | surachai
I have question about board baking after in line washing machine then I would like to know some information that ; 1) Do we need board baking after in line washing machine? Both bare board and assembly borad normally we don't bake . 2)In case of ne
Electronics Forum | Fri Nov 02 12:01:26 EST 2001 | mparker
I have two cases where I must bake after DI wash. The moisture entrapment is specifically within microprocessor sockets. Without air gun blow out and baking, oxidation occurs that causes flaky contacts for the PGA. We will bake for 2-3 hours @ 60C. O
Electronics Forum | Wed Dec 03 07:30:57 EST 2008 | realchunks
Hi System Steve, What is a solvent cleaner over water wash? Solvent first and then rinse with water? And why do they feel the need to bake the boards? Do they think trapped moisture will cause board damage?
Electronics Forum | Tue Jan 06 14:37:27 EST 2009 | stevek
The easiest way to prove out the absorbtion theory is to weigh the parts before wash, after wash, and after baking. You probably want to do this with the bare parts in isolation as the fab will pick up considerable moisture. Differences in weight s
Electronics Forum | Thu Dec 11 11:59:23 EST 2008 | joeherz
Update - We've tested a board previously having voiding issues with ENIG versions and the voiding has completely disappeared. No other variables were changed. Looks promising. I have an order of LF HASL boards arriving soon that we plan to split i
