Electronics Forum: wash bake (Page 8 of 15)

di water washing

Electronics Forum | Wed May 05 13:47:00 EDT 2010 | davef

For sources of baking ovens, look here: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=56260

Baking a Populated PCB

Electronics Forum | Fri Jul 30 14:53:01 EDT 1999 | Tom B.

Hello Netters, I have a customer who wants us to aquaeos wash a PCB after all operations have been performed. The PWB is two layer FR4 with a Transformer, a Multichip Module with Conformal Coating, (6) 11" insulated wires that are tinned on exposed

Re: labeling systems

Electronics Forum | Fri Aug 28 18:57:49 EDT 1998 | Mike Cleary

Selecting the correct label solution for SMT labeling is a science. Our company is a supplier of electronic identification products. Please let me know if you have questions regarding materials, printers, etc. I have been in this industry for over

Re: Radial capacitors have water gain

Electronics Forum | Tue May 11 06:30:41 EDT 1999 | Joe Byrde

| | | | | | | | | | | I left the company before this thing ever got resolved, so I don't know the answer, but here's what we did to get boards out the door. Baked them in a desicating oven. You know, the kind that pulls vacuum? It was a regular

Water Residue Stains - how to remove?

Electronics Forum | Wed Dec 19 01:17:13 EST 2001 | ianchan

Hi Experts, I need help here, advice appreciated from all... Production is running a Lot of flex-circuit PCB, through the SMT line, with 0402 components. The flex-PCB is taped to FR4 support "pallets" when processing thru' the SMT P&P m/c. We use

Re: Drying ICs any advice

Electronics Forum | Fri May 15 10:41:12 EDT 1998 | Dave F

| | | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin pac

Re: Drying ICs any advice

Electronics Forum | Fri May 15 17:31:04 EDT 1998 | Steve Abrahamson

| | | | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin

Re: Make That F

Electronics Forum | Fri Jul 30 19:58:28 EDT 1999 | ScottM

| | | Hello Netters, | | | | | | I have a customer who wants us to aquaeos wash a PCB after all operations have been performed. The PWB is two layer FR4 with a Transformer, a Multichip Module with Conformal Coating, (6) 11" insulated wires that are

Wave Solder - solder bubbles/outgassing??

Electronics Forum | Tue Nov 21 19:23:15 EST 2006 | greg york

Had exactly the same problem the other week. Baked some boards did improve slightly but not convincingly. Washed bare PCb and found excessive HASL fluids left on board from improper rinsing and problem disapeared. Baking HASL fluid out is impossible

Re: Moisture Bake-out of Plastic Parts

Electronics Forum | Tue May 26 15:49:05 EDT 1998 | Earl Moon

| | We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg


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