Electronics Forum | Mon May 24 19:24:35 EDT 2010 | jry74
We bake all of our boards at 220 degrees F for two hours. This bakes out all the moisture. Blow off the parts prior to placing in the oven.
Electronics Forum | Tue Feb 01 12:02:56 EST 2000 | Mike Konrad
Your question may be answered in two parts. First, if you are using a water soluble (OA) paste, then water is an excellent �solvent�. Water, in one way or another, is used to clean all fluxes and pastes from PCB�s. In some cases, a chemical is add
Electronics Forum | Mon Apr 25 02:25:32 EDT 2005 | Mike Konrad
The issue of using ultrasonic technology for post reflow de-fluxing presents challenges in two categories: Controversial: Although there are recent studies that indicate acceptance with ultrasonic technology on populated assemblies, there remains si
Electronics Forum | Tue Nov 02 07:50:18 EDT 2010 | babe7362000
I just need a clarification on NC254 No clean solder paste. If we have parts on the bottom side of the board that already are soldered and we go to run the other side of the board and it was misprinted, is it ok to run thru the washer? I just need
Electronics Forum | Tue Oct 25 15:19:15 EDT 2005 | jimmyjames
Sorry this is such a long thread but I would like as much input as possible to everything I ramble on about... :) ------------------------------------------------------ We are now seeing more and more RoHS parts showing up in our SMT inventory and
Electronics Forum | Wed Mar 24 17:09:34 EDT 2010 | davef
RE Search: Search can be tricky. Try MSD and wash
Electronics Forum | Thu Mar 25 09:27:08 EDT 2010 | stepheniii
Thanks I guess I got used to google where the "and" is implied. I searched various combinations and all I could find were threads regarding the pcb's not the components. Does anyone bake their boards after wash before second reflow because of MSD c
Electronics Forum | Wed Mar 24 16:54:38 EDT 2010 | stepheniii
J-STD-033B.1 Says "For cavity packages in which water may be entrpped, water clean processes after first reflow can be an additional source of moisture. This may present an additional risk, which should be evaluated." And it talks about derating if
Electronics Forum | Mon Jan 30 16:30:55 EST 2006 | GS
Hi James, it could be the problem is due to residual of cleaner media entrapped under low gap of QFP 208 and 0,5 mm lead pitch. I remember in the past we had random problems of failure at test after board wash off process (DI Water wash). We met
Electronics Forum | Wed Nov 17 08:13:41 EST 2004 | grange GAA
We are manufacturing an NPI board for a Customer and they want us to wash the board using a Saponifier wash. However, one of the SMT parts cannot be placed through a wash process. Has anyone ever had to encapsulate a component to prevent water da
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