Electronics Forum | Wed Feb 02 13:05:51 EST 2005 | russ
Process flow 1.Remove part - It may be necessary to bake assembly prior to removing. 2.Remove remaining solder from part 3.Apply flux to part 4.Apply solder spheres to part 5.Reflow part You may want to bake component before re-installing 6.Apply
Electronics Forum | Fri Dec 01 14:12:50 EST 2000 | Jim M.
My company currently uses water soluble paste for our SMT process. We were having trouble retaining hot water in our in line, closed loop DI cleaner. The cleaner kept shutting down when the water temp. dropped below 125C. As a result, the conveyor
Electronics Forum | Wed Sep 13 12:36:14 EDT 2000 | Steve Thomas
In the following thread, http://www.smtnet.com/electronicsforum/view_message.cfm?message=9584& John Thorup touched on some applications where no-clean fluxes could be a bad idea. I'm looking for some more detailed info. (papers, references, texts
Electronics Forum | Fri Dec 01 15:37:50 EST 2000 | Dason C
Jim, you may need to look with different paste instead of the cleaning solvent. Please advise what is the paste which you currently using? Beside, when you talking about the board stayed in hot area, is it a drying area or the cleaning zone. If it
Electronics Forum | Fri Dec 01 16:02:33 EST 2000 | Jim M
Thanks for your reply. I 've tried to clarify and answer your questions. The water soluble paste used is WS3060, type 4. The boards are sent through a inline di cleaner after reflow. There is a hot Di waterwash, rinse and then hot air to dry the wa
Electronics Forum | Fri Dec 01 17:03:57 EST 2000 | Dave F
Curious, very curious ... Residues � Where are these residues? [solder & laminate / mask, solder only, laminate / mask only] What is the result of your analysis to the residues? How do you know it�s a flux residue, rather than a chemical by product
Electronics Forum | Fri Sep 15 09:24:54 EDT 2000 | C.K.
At my last place of employment, that was the big reason why nobody (especially the Design Engineers) bought into a no-clean process - interference with high-impedance circuits. One guy was so paranoid about flux residues remaining on the board, that
Electronics Forum | Wed Apr 19 16:03:58 EDT 2000 | Steve Harshbarger
David, Your concern is legitimate regarding the aggressiveness of VOC free flux. Water (the main substance of VOC free flux)is much more aggressive than alcohol. You will have an increased need to be more cautious from a compatibility standpoint, r
Electronics Forum | Tue Aug 22 10:53:45 EDT 2000 | Dr. Ning-Cheng Lee
Excellent question. Alloy development is relatively easy compared to flux formulation. New fluxes for Pb-Free alloys need upgrades in 2 critical areas: 1) thermal stability 2) oxygen barrier efficiency Since the Pb-Free alloys require reflow proce
Electronics Forum | Wed Apr 19 13:32:51 EDT 2000 | C.K.
Dave: The main part of your machine that VOC-Free fluxes attack is your spray fluxer itself. If you haven't already, you'll need to purchase a spray fluxer that's designed to accomodate water-based VOC-Free fluxes (i.e. made of stainless steel with
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