Electronics Forum: wave solder machine (Page 491 of 677)

Wavesoldering

Electronics Forum | Tue Mar 13 07:09:15 EST 2001 | Sal

Guys Just a quick wavesoldering question . What I would like to know is : What causes opens on test points on a single sided board which is fully exposed when it goes over the wave ? The problem is so intermittent that it's doing my head in. The flu

Selective pallet thickness

Electronics Forum | Tue Apr 10 10:10:03 EDT 2001 | Rob Fischer

Obviously the less mass in the wave the better. There will be less heat sinking and less push on the solder. Pallet thickness is typically a function of the tallest component on the board. If the board has one component that is tall but small in a

SMT layout for multiple packages

Electronics Forum | Thu Apr 26 18:39:45 EDT 2001 | jagman

I'm looking for information (links) to pad design and layout spec's for different sized passive SMD's. To be specific, 0603, 0805, 1206 and 3216 sized parts. I'm most interested in finding out about land spacing between two parts. What is accepabl

Re: Pb-Free

Electronics Forum | Tue Aug 22 16:22:37 EDT 2000 | Dr. Ning-Cheng Lee

There are certainly many pb-free options being considered by the industry. Currently, the most promising alloys appear to be various combinations of SnAgCu. SnAgBi could also be an option, but to use this alloy, there must be no Pb in the surface f

Pin & Paste on Thick PCBs

Electronics Forum | Fri Jun 15 09:13:53 EDT 2001 | jackofallprocesses

Does anyone have knowledge or experience with Pin & Paste on boards that are .095" thick? The boards would have mixed technology, PTH, fine pitch, and BGAs. I did a search for this info and nothing touches on this particular subject, thicker boards.

Re: Adhesive on hot PCBs

Electronics Forum | Mon Dec 13 21:05:34 EST 1999 | Curtis T.

Ken, we always build the bottom side of the board first. That also insures that there isn't any problems with the actives being reflowed and falling off in the glues curing process. By the way we do both paste and glue on the bottom of the boards t

Re: Popcorning BGA in wave-soldering

Electronics Forum | Tue Oct 19 22:27:29 EDT 1999 | Stu Leech

We have just completed some studies of with ABPAC, who is a large subcontract assembler of plastic ball grid arrays. BT laminates can pick-up appreciable moisture in just two hours. They are using TVP demoisturizing, our product (I apologize for the

Re: Use of chip bonding adhesive.

Electronics Forum | Wed Oct 06 20:42:50 EDT 1999 | Mike Cooper

Yes. We use high speed dispensing (PanasonicFA)as an integral part of our PCB assembly. Our business is automotive electronics and our typical product is 2-sided smd with some through hole. We assemble topside first, through hole, then bottomside. Th

Re: water soluble mask

Electronics Forum | Sun Sep 26 11:54:06 EDT 1999 | Earl Moon

| i had a problem here, during the wave soldering process, we apply a water soluble mask on the gold finger to protect it from contamination. But after washing, there is still some mask left on the gold finger. | Can anyone pls advise is there any pa

Re: DE-IONIZED WATER SUPPLIERS

Electronics Forum | Fri Sep 10 09:49:49 EDT 1999 | C.K.

1 MOHM, 18 MOHM)? | | What state are you located? | | What type of volume will you use (1 drum per week, month, year)? | | Mike | (800) 218-8128 | We are located in Illinois (Southwest Suburb of Chicago). Our usage will probably be in the 1 dru


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