Electronics Forum | Fri Mar 19 11:01:42 EST 1999 | Dave F
| Hi folks, | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and volume, and somet
Electronics Forum | Fri Mar 17 21:44:14 EST 2000 | sosina_outry
Daren: suggestion from a friend of mine 1. Is residue on the top or bottom of the board? If on the bottom, then you might need to do solder dedross. if on the top, you might need to check 1. after spray flux, check for any excess flux on the top of
Electronics Forum | Fri May 26 01:50:54 EDT 2000 | Craig
We have no experience in printing glue only in dispencing for short runs. We are finding that our gluing volumes are going up and want to look at screen printing as an option. We are placing 0805 and 1206 chips, melfs, sots and ics. What are the adva
Electronics Forum | Wed Jan 12 16:11:26 EST 2005 | russ
I have seen the solder shoot out at least 4"-6" from both the leading and trailing edge when this happens. If the open pockets are real deep you may want to use a turbulent/chip wave for soldering, sometimes this leaves bridges however.
Electronics Forum | Tue Jul 13 14:19:00 EDT 1999 | JohnW
| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec
Electronics Forum | Tue Jul 13 14:25:57 EDT 1999 | Earl Moon
| | | | Hi, | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | |
Electronics Forum | Wed Jul 14 21:34:16 EDT 1999 | karlin
| | | | | Hi, | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | |
Electronics Forum | Wed Oct 06 20:46:10 EDT 1999 | Mike Cooper
We have same equipment and used the same adhesive. Switched to Loctite 3618 and problem went away. Check cure profile again. 150C at 90s best. Also, check dot size/patterns. Double dots for chips and 4-dot for SOTs works well for us. Regards.
Electronics Forum | Mon May 29 02:15:06 EDT 2000 | Dreamsniper
Hi Buddy, We've tried shifting to this process before and from our point of view here are some of the advantage and disadvantages that we discovered. Advantage 1) Cheap Equipment cost as you just need to use your Solder Paste Printer rather than buy
Electronics Forum | Thu Jul 15 14:38:38 EDT 1999 | JohnW
| | | | | | Hi, | | | | | | | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants)
