Electronics Forum | Fri Aug 28 23:32:39 EDT 1998 | Pete Sorenson
| Does anyone have any experience they are willing to share on Ag epoxy used as a copper through hole plating replacement? Was CEM3 used? | What are the limitations? | Thanks, | Steve I have used silver epoxy extensively for conductive bonding applic
Electronics Forum | Wed Feb 11 09:07:37 EST 2004 | Ashok Thiyagarajan
HI I am currently having a wafer which is stud bumped (Au), I am printing conductive adhesives (with silver fillers) on the pads , and by thermocompression bonding, I am establishing the connnection between. But right now the problem is the silver
Electronics Forum | Fri Nov 18 12:35:15 EST 2011 | rway
As the article eludes to, you still need probe access to measure the pins with TestJet. One thing I wanted to add was the use of JTAG for use with Boundary Scan. Certain devices have JTAG capability, but not all JTAG devices are Boundary Scan compa
Electronics Forum | Wed Jan 09 14:52:53 EST 2002 | Chris
Hi, I have read many articles about theromsonically bonding to soft gold. Many of these articles state you can bond to 10uinches of gold. I have worked with both Hughes and Panasonic bonders at two different companies and I have never been able to
Electronics Forum | Wed Jan 09 18:17:15 EST 2002 | Chris
I don't have a plasma cleaner either. It will help a lot. Actually I don't clean at all. Our wirebond pads are far enough away so the flux residue does not get on the wirebond pads. That's what we think anyway. I am sure we have some degree of c
Electronics Forum | Wed Jan 09 21:19:49 EST 2002 | davef
When I said "In this area, there is no difference between your experience in ceramic substrates and PTFE substrates." I was referring to the area we were discussing ... gold plating. I am sorry if you thought I ment than the wire bonding process wa
Electronics Forum | Wed Jan 09 17:14:48 EST 2002 | mregalia
Do you bond with Al or gold wire? What happens if the Ni is over 150 microinches? Thickness of nickel is one those things that we have not been consistent with. The industry seems to pretty much universally call for 100-200 microinches. Our old board
Electronics Forum | Mon Jan 07 13:18:28 EST 2002 | mregalia
I work for a microwave company. On our lower frequency boards (
Electronics Forum | Wed Jan 09 12:20:00 EST 2002 | mregalia
Thanks for cluing me into IPC-2221. Though the numbers they give seem to contradict what I have learned from people working with the materials. At least I now know where the guideline for a max of 30 microinches of gold for soldering comes from. But
Electronics Forum | Wed Jan 09 17:03:44 EST 2002 | rob_thomas
We follow IPC-2221 recommendations for Au and don't have a problem as long as the Ni is under 150 microinches.This ensures a consistent process for us.Also we do plasma clean after SMt and prior to wirebond.That makes a big difference. Rob
