Electronics Forum: wedge and bond (Page 5 of 6)

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Mon Jun 08 14:52:16 EDT 1998 | Gary Simbulan

| Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. | First the caps. We stil

Wire Bonding fiducial mark specifications

Electronics Forum | Wed Jan 31 17:30:54 EST 2007 | GS

Thanks a lot flipit, I am not directly involved in this "problem" but is my friend that have his CM rejecting PCBs because it says the "+" mark (spokes lengths) are out of tolerances. It seams CM bonder's require tolerance +/- 0,05(? not sure). I d

Re: Heat seal ribbon to gold plated fingers and lcd displays

Electronics Forum | Sat Oct 24 23:30:59 EDT 1998 | Pete Sorenson

| I know that this not surface mount, but many of us have to perform multipule duties. Can anyone give me some information on this I am having problems getting relibility | getingthe heat seal ribbon to make consistant electrical contact. | Any help

QFP208-Leads for MCM-L?

Electronics Forum | Fri Apr 17 21:46:18 EDT 1998 | Matthias Mansfeld

I plan to design a multichip module which contains 1 chip with about 200 pads and 2 chips with about 50 pads, no other components.The whole module shall replace as intermediate solution a single chip CPU in QFP208. Thus, the MCM itself must have t

aluminium wire bonding on Electroless Nickel + Immersion gold

Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef

This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R

Large Area Wire/Wedge Bonder

Electronics Forum | Wed Mar 10 15:45:24 EST 2010 | flipit

Looking for a large area wire ball bonder or wedge bonder. Must be able to take 4" X 5" panel and have a bond area of close to 3.5" X 4.4". Also need 6 to 8 wire per second. K&S no longer makes one. Panasonic no longer makes one. ASM does not mak

Large Area Wire/Wedge Bonder

Electronics Forum | Tue Mar 16 18:36:11 EDT 2010 | janz

Looking for a large area wire ball bonder or > wedge bonder. Must be able to take 4" X 5" panel > and have a bond area of close to 3.5" X 4.4". > Also need 6 to 8 wire per second. K&S no longer > makes one. Panasonic no longer makes one. ASM

Wire Bonding fiducial mark specifications

Electronics Forum | Tue Jan 30 17:58:49 EST 2007 | flipit

Hi, I would not be too concerned about what the shape of your wirebonding fiducial is. Cross, Square, Diamond, Circle, will all work well for you. I use a "+" and a diamond. Your machine magnification will be great, so don't make the fiducials to

aluminium wire bonding on Electroless Nickel + Immersion gold

Electronics Forum | Fri Aug 17 01:40:55 EDT 2001 | V.RAMANAND KINI

We are in the watch & clock Business. We have a Watch IC chip that has to be wirebonded using Ultrasonic aluminium wedge bonder. The wire dia is 1.25mil. The PCB is made of G10 Glass epoxy copper clad laminate. The copper thickness is 18 microns. The

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