Electronics Forum: wet (Page 168 of 182)

Re: Solder Joint Problem

Electronics Forum | Thu Jun 25 14:33:51 EDT 1998 | Chry

| Hi there Chris! | Are the leads you talking about fine pitch? Is the complete fillet attached to the foot, with it being cleanly separated from the pad? I bet if you look at the board there will be via's really close to the pads at the location

Re: PCB Standards

Electronics Forum | Wed Jun 10 18:40:00 EDT 1998 | Earl Moon

| I am looking for the Industry standards on vias. Are they required to be plated with solder or is copper plating enough? What about reliabilty with either one? Also, if tenting the via is required should it be copper plated or solder plated over

Re: reflow theta alignment

Electronics Forum | Fri May 29 13:42:34 EDT 1998 | Steve Gregory

Hi Jason! I can probably find something documented for you, but the easiest way to convince your QA people is just to show them. If you have a board around that has some 1206 locations all in a row, print the board with paste and then plac

Re: reflow theta alignment

Electronics Forum | Fri May 29 16:12:11 EDT 1998 | Jason Gregory

| Hi Jason! | I can probably find something documented for you, but the easiest way to convince your QA people is just to show them. | If you have a board around that has some 1206 locations all in a row, print the board with paste and the

Re: Residue

Electronics Forum | Tue May 26 19:20:39 EDT 1998 | Graham Naisbitt

Ryan, Please consider the following: There is no such thing as no residue flux. Low or no solids flux contain "wetting" agents to help the stuff stick upside down! Try painting your ceiling with less than 2% solids paint!! With all this excess liquid

Re: Drying ICs any advice

Electronics Forum | Fri May 15 10:41:12 EDT 1998 | Dave F

| | | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin pac

Re: Waving TSOPs

Electronics Forum | Fri May 08 18:39:17 EDT 1998 | Steve Gregory

| | As usual, we are faced with too many components and not enough board on a new design. Does anyone have experience wavesoldering .025" pitch TSOPs on the bottom side? | | Any advice is appreciated. | | Greg Hi there Greg! First, I just gotta

Re: Wierd Tombstoning on Tant Caps

Electronics Forum | Fri May 01 14:44:26 EDT 1998 | Earl Moon

| I've never seen this before. Today, I got this tombstoning on Tantalum Capacitors (Okay, I saw that before) | Here's the part that seems weird to me: | -They didn't tombstone onto a termination - they went onto their sides! That's right, both ter

Re: SM Headers & Connectors

Electronics Forum | Tue Apr 14 15:50:45 EDT 1998 | Bob Barr

Justin, Thanks for the response to my dilemma. For once it's not just me! The parts seem perfectly solderable, but I will try the modification to the profile you suggested. I wonder if the retention clips may be letting loose from the holes they a

Re: Entek coating

Electronics Forum | Tue Mar 10 22:16:56 EST 1998 | Steve Gregory

Jeremy, I'm gonna make a couple of assumptions by "reading in between the lines" of your email: 1. You're using no-clean paste. 2. This is only happening on the second side. You tell me if I'm wrong about this... First thing, if you're only experienc


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