Electronics Forum | Sun Nov 25 20:47:44 EST 2001 | Yngwie
knock!!!knock!!!Hellooo!!!!!!!
Electronics Forum | Mon Nov 26 21:03:29 EST 2001 | davef
Hehwoo, bin eatin' turkey up at mums house.
Electronics Forum | Mon Jul 29 18:59:08 EDT 2002 | davef
Stand-ups are a common problem with 0402. Search the fine SMTnet Archives to get started.
Electronics Forum | Tue Jul 30 17:47:50 EDT 2002 | davef
Dewetting: Solder does not adhere to lead or land, caused by: * Poor solderability of lands. * Poor solderability of leads. * Solder paste integrity. * Lead plating integrity. Need more information, please: * What is dewetting [ie, component, pad, e
Electronics Forum | Wed Jul 31 17:35:16 EDT 2002 | davef
* Finally, when soldered by hand, do the problem pads take solder? Yes, the XRF analysis will be interesting.
Electronics Forum | Fri Sep 03 04:04:19 EDT 2004 | doi
Thanks davef for a your insights :)
Electronics Forum | Thu Mar 31 06:09:19 EST 2005 | amstech
Yes, components do contribute to the non wets in fine pitch reflow. Oxidation is the main culprit. May ask where it is coming from. Can not say in particular. May be burn in test process or end of line baking, hot / cold testing and need to run DOE'
Electronics Forum | Mon Mar 21 09:33:25 EST 2005 | davef
RoHS Substance||RoHS MCV Limits||Typical Testing Approaches Lead||1000 ppm* ||Wet chemical digestion followed by ICP (Inductively coupled plasma) or AAS (atomic absorption) spectroscopy ||||XRF (X-ray fluorescence) spectroscopy Cadmium||100 ppm ||Wet
Electronics Forum | Mon Apr 04 09:27:32 EDT 2005 | russ
I would bet that you never wetted to the nickel.
Electronics Forum | Thu May 05 09:50:29 EDT 2005 | patrickbruneel
Hi Hannu, You just gave a very realistic and practical view of the lead-free dilemma. The main reason that your coil coating doesn't get removed is because of the inability of lead free alloys to wet the surface and conduct the heat. Higher temperat
