Electronics Forum | Tue Sep 26 08:41:27 EDT 2000 | greg
I am processing PCB's that have an n-tech osp coating and am finding huge inconsistencies in wetting. Some boards process clean with good wetting and the next has terrible wetting. The boards are stored and handled properly. Has anyone had this
Electronics Forum | Mon Apr 23 14:02:26 EDT 2001 | relensky
I am looking for a repeatble method to determine the quality of solder wetting to a PCB. I would like something that I can perform in-house, at low cost, with reliable results. My goal is to test the wetting on white-tin PCB's, after repeated reflo
Electronics Forum | Sun Oct 11 13:53:26 EDT 1998 | Vincenzo Longobardo
I have datas to substain that a not wetting PCB ( the HAL oxided or not uniform in thickness )if soldered in reflow, it shows voids with X-Ray inspection.The voids are in side all the joints not only on the solder pads levell. Is there a technical d
Electronics Forum | Wed Jul 09 13:48:03 EDT 2003 | russ
Sam, You may want to be careful with your analisys, reducing paste volume also reduces flux volume. Flux is there to promote and aid in wetting. by reducing flux you may have initiated the poor wetting yourself with the experiment. Just anothe
Electronics Forum | Thu Sep 02 05:12:15 EDT 2004 | doi
I am using a triad connector and have problem with wetting at both connector latches.Observed that the leads have very good shiny wetting however concerning the latches the solder just seem to disappear to thin airafter reflow.The connector has a gui
Electronics Forum | Thu Sep 02 09:51:53 EDT 2004 | davef
We see latches from some suppliers that just are not solderable. Usually the nickel plate on the latch is poor, allowing the nickel to corrode, and requiring a more active flux [if you're lucky]. But lots of times, you end-up with partial wetting,
Electronics Forum | Wed Mar 30 01:01:10 EST 2005 | vicknesh28
All, Has there been any finding from the component point of view in terms of non wets after reflow and if yes, can anyone share what was improved on the component to reduce the non wet defective levels. What would be the contribution from the compon
Electronics Forum | Thu Mar 31 19:52:50 EST 2005 | davef
We agree with Russ that you're talking palladium instead of platinum. Your wetting problem likely is not the Pd-Ag surface layers, but the underlying metal or nickel to which you need to wet. Either a base metal is: * Contaminated and poorly wettabl
Electronics Forum | Mon Jan 09 07:50:53 EST 2006 | slthomas
When I had that luxury I always used a double pass, first wet then dry, to reduce the amount of wet solvent left on the stencil. That also gives it some time to evaporate. If you've got suction I don't know how you'd ever get any through the aperture
Electronics Forum | Mon Jul 23 09:43:50 EDT 2007 | pjc
From NASA document: Conformal coating thickness shall be determined using a wet film thickness gauge,....... Wet Thickness Gauges can be obtained: Wet film Thickness Gauge P/N 790010 Nordson Corp, Amherst, OH or http://www.nordson.com/cgi-bin/MsmG
