Electronics Forum | Wed Sep 10 12:44:55 EDT 2008 | vladig
Well, it wasn't as easy to figure out the root cause. The last image is below. It shows how the board finish looks like (the trace was under solder mask). AS you can see, the layer of E-Ni is spliting (the board shop admitted the problem afterwards).
Electronics Forum | Thu Aug 28 11:31:17 EDT 2008 | patrickbruneel
Matt solder mask finishes gives the widest process window in view of potential amount of residues when using No-Clean. Shiny (glass like) finishes are more sensitive to residues due to lower surface area compared to matt finish. If the shiny finish i
Electronics Forum | Sat Oct 18 20:35:25 EDT 2008 | arosario
I see, maybe changing my peak temp in reflow will help. I'll try do eval again... Actually, once I did have evaluated a longer pre-heat but on my previous eval, I didn't change the peak temp. Maybe reflow can help compensate to my problem in the part
Electronics Forum | Tue Oct 21 11:42:04 EDT 2008 | arosario
Hi Shooter, we're not using AOI but we do every 30 minutes sampling Inspection on the board and we're not seeing insufficient paste deposit so far since we started. But I agree with you that seemed my printer is not printing consistent amount of pa
Electronics Forum | Fri Oct 24 13:21:12 EDT 2008 | evtimov
Hello Bong, I would make one test only. Make one batch using the problem part from a different vendor. That will answer your main question. For me the part is causing all your problems. If it is possible, change it. Last time having problem like you
Electronics Forum | Tue Nov 18 07:22:56 EST 2008 | wewilldoit
Hi folks! TI told us that we are the only one with the following problem... We discovered a really bad wetting characteristic of some SMD ICs from BurrBrown. At the moment: XTR106 / INA118 / ADS7844. After the reflow process we found out that this pa
Electronics Forum | Tue Dec 09 10:04:36 EST 2008 | lazzara55
SMT-ypw: Does PWB supplier start to implement PWB drying packaging? B3: YES! The fabrication of the PCB involves a series of wet processing that requires counter-measures to remove moisure. While some of the PCB processes also include bake cycles th
Electronics Forum | Tue Dec 09 21:07:12 EST 2008 | davef
We don't remember hearing from you you here for a looong time. Welcome back. For: * Getting your toes wet in a variety of cleaning topics at Dann Tersteggie's excellant jump site: http://www.smtinfo.net/Db/_Cleaning.html * More than you ever wanted
Electronics Forum | Fri Jan 16 13:11:27 EST 2009 | evtimov
HI , A LOT OF SIMILAR ISSUES WERE DISCUSSED LATELY. MOST OF THE TIME THE PROBLEM IS IN THE BOARD FINISH. THE BEST OPTION IS GOLD FINISH(ENIG). MAKE A SAMPLE AND TRY IT WITH BOTH PASTES YOU HAVE. ANOTHER THING I DID BEFORE AND IT HELPED ME PARTIALLY
Electronics Forum | Fri Jan 30 04:10:10 EST 2009 | sachu_70
Hey Daniel, N2 gas provides an inert atmosphere which help to minimise oxidation, generally a concern across the reflow zone. Although N2 provides a more shiny solder joint, it is certainly more of a cosmetic issue and does not certify joint reliabil
