Electronics Forum | Fri Sep 15 07:55:32 EDT 2017 | kubabel
Dear Thanesh, did You alrady solved issue? We are facing same problems... Unfortunately reject rate is too small to find something wrong directly in production...
Electronics Forum | Wed Sep 20 12:12:51 EDT 2017 | edhare
SEM Lab, Inc. supports this type of analysis. Please see semlab.com & semlab.com/blog for examples. Thanks!
Electronics Forum | Thu Mar 02 13:59:38 EST 2017 | horchak
Slim chance it's the nature of the beast if in original unopened package. If handled by anybody not properly trained they will get bent. Allso make sure your pick and place is seating them into the paste, any lead not contacting the wet paste will be
Electronics Forum | Fri Jul 28 12:16:34 EDT 2017 | dontfeedphils
I'm pretty sure that in the job description of each QA related position it lists "Ensure Process Engineering is always being hassled because you inspect to target and not acceptable."
Electronics Forum | Mon Aug 14 14:53:51 EDT 2017 | emeto
AIM, Indium , Alpha will be your top 3 choices. I did paste evaluation before with 4 paste manufacturers and Kester was my choice number 4. Profile according to the paste specs and observe results.
Electronics Forum | Mon Sep 25 01:42:02 EDT 2017 | bukas
hi everyone, i'm looking for someone to fabricate new or sell used wetted nozzles for Ebso SPA 250/400 soldering machine.
Electronics Forum | Mon Aug 20 10:17:50 EDT 2018 | mefloump
Toluol (toluene). I use it in the solvent cups in my PVA machines to keep the nozzles wetted. We also use it to clean spots where coating is not supposed to be. Techspray 2510-N coating remover pen will also work very well for this.
Electronics Forum | Fri Aug 24 08:49:54 EDT 2018 | davef
My first guess at the cause of your components skewing -- Termination pads on the board to not well match the the soldered terminals on the components, causing unbalanced wetting forces on the component terminations while the solder is molten.
Electronics Forum | Fri Aug 24 12:59:03 EDT 2018 | cupet
Dear davef, but this LED is skip component, that's a blank footprint and one of its pad is badly wetted...this is the reason for my thinking about contamination. Do you mean different solder paste with more aggressive flux?
Electronics Forum | Wed Nov 21 05:57:30 EST 2018 | premkumar_haribabu
Hi Robl, Thanks for your qucik reply!! , i understand if we use aggresive flux that we can impove solder wetting over nickel plate vs PCB pads & we need to solder through 12 zones reflow oven. Prem
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