Electronics Forum | Thu Nov 04 07:53:45 EST 1999 | Chad Notebaert
Sounds like you have a component problem! I say this because you say the sodler is flowing away from the components (leads I assume) This sounds like none wetting of the component. Do a solderability test on the parts. Take the parts and dip the lead
Electronics Forum | Mon Nov 01 17:13:37 EST 1999 | Mark W.
Jason, What is the revision of IPC you are referring too?? IPC 610 rev. b requires 75% fill on classes 2 & 3. Class 2 does allow the exception of 50% fill if the PCB has a Metal Core or Thermal/Heatsink Plane provided that the solder extends 360 de
Electronics Forum | Fri Oct 29 10:02:28 EDT 1999 | John Thorup
Chris A lot of people have reported sudden, fab lot related problems with Ni/Au pads. These are usually characterized by a discoloration of the gold and called cheerful names like "black pad disease". This can be a process problem at your fab house
Electronics Forum | Fri Oct 01 05:03:28 EDT 1999 | Wolfgang Busko
| | | I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. | | | What is the best way
Electronics Forum | Fri Aug 20 11:24:54 EDT 1999 | Chuck B.
I am being asked, by my vendor and Purchasing people about converting from Tin/lead pads on P.C.B's to Electroless Tin Plating. Can any one tell me what I have to change in my SMT process (paste, reflow, etc) If any? I ran one P.C.Board and I
Electronics Forum | Fri Aug 20 10:18:32 EDT 1999 | Dennis Fall
I have a layer of electroplated solder (10/90) that appeares to have some sort of contaminent on it. Water will not wet to the layer in some areas. I have tried using 10% HCl in DI as a cleaner as well as 7.5% Fluoboric acid in DI. Neither has tou
Electronics Forum | Mon Aug 16 09:50:20 EDT 1999 | Earl Moon
| Hello reflow experts, | | I just wanted to know the effects of N2 and O2 on reflow furnace to the solder ball apperances. | | thanks in advance.... | | ...Omat | | Not really that much with eutectic balls and solder pasted pads and the reflow
Electronics Forum | Fri Jun 25 01:11:31 EDT 1999 | Vinesh Gandhi
| | | Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody
Electronics Forum | Mon Feb 15 15:43:06 EST 1999 | Dave Jurena
Hope some of you out there can help me with this one. I am getting feedback from our test department that they are showing opens on solder joints which have visually good wetting. The touch-up operators confirm that the joint looks good. All they do
Electronics Forum | Fri Feb 12 10:44:02 EST 1999 | Bill Haynes
I am fairly new to the SMT game and I am getting conflicting answers to the following. Maybe someone can help me! When printing, one person is telling me that the stencil should be wiped completely clean of all paste because the quality of the pr
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