Electronics Forum | Tue Jul 31 18:46:40 EDT 2007 | rpadilla
Well, everyone has provided good advice, but if you are looking for a wave flux that can provide much better dwell times and consistent wetting throughout the hole fill, without making adjustments to your production process, I suggest going with Senj
Electronics Forum | Thu Oct 12 22:36:40 EDT 2017 | stefan110882
Please ost some pictures so we can see what > you're talking about. OK here an example. I'm sorry for the bad quality - The picture is cropped and only one of two pictures that I had on the phone that I could use. According to my supervisor, th
Electronics Forum | Thu Apr 21 14:16:47 EDT 2005 | sumote
Wet/Dry/Vac is pretty standard. We mostly use Wet/Dry/Dry. Nice to see that I am not the only one still using the 288 machine.
Electronics Forum | Mon Apr 28 11:13:21 EDT 2008 | ck_the_flip
Here's a crude wettability test. Take a PCB - both types of finish - print them, and reflow with no components using your standard profile. Observe the wetting spread and flow of the solder paste. This rules in/out that it's PCB solderability.
Electronics Forum | Tue Sep 01 02:57:42 EDT 2009 | d0min0
davef As for the repair : - with hot air blower it is not possible (you can melt, but it will not wet) - with standard iron - no problem to repair (no additional material is needed) isd.jwendell yes, the profile is checked on those places (same si
Electronics Forum | Thu Jul 10 22:34:34 EDT 2008 | davef
We wouldn't get our underware in a knot about poor wetting on a lead that is not connected to the board. IPC standards seen to say that the inspector should use common sense in interpreting standards requirements. Then again, it's not all that common
Electronics Forum | Thu Jun 01 05:06:10 EDT 2006 | EC
Hi, I facing some 1005 component with poor wetting and look like not enough solder...... Is there any standard solder paste volume requirement. Appreciate all the input.
Electronics Forum | Fri Apr 16 15:25:01 EDT 2004 | ianlg
Hi Debi You might like to also include the R29-V which is a step up from both the Dek 248 and Microflex but at a similar price. 29" frame size ( multi-purpose adp available ) Bespoke software windows based, Incredibly easy to operate. Similar toolin
Electronics Forum | Thu Jun 25 16:13:05 EDT 1998 | Mike McMonagle
I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. Everything
Electronics Forum | Wed Jul 09 10:15:57 EDT 2008 | aj
I have carried out some further measurements on the device and the results are as follow: Component Lead width measures 183 microns. Actuals PAD width measures 158 microns. What I am thinking is that the lead is attracting the solder hence prevent
