Electronics Forum | Thu Nov 21 05:44:07 EST 2002 | kcorrin
We produce several boards with reflowed components on top and bottom. We are finding the solder has wetted to the leads but did not flow completely to the end of the lands. Several factors/causes?: 1) Board warping but paste deposits look good. 2) Mo
Electronics Forum | Thu Apr 19 02:49:07 EDT 2007 | ray
I observed some black dot or some oxidation occured on chip termination on pcba reflowed fews weeks ago as buffer stock. The solder joint and fillet wetting is good and shinning. It is an acceptable or defect condition per IPC standard/requirement? W
Electronics Forum | Thu Sep 02 10:51:45 EDT 2004 | patrickbruneel
Hi Ken, Thank you for the reply Ken. I hope I don�t get my behind in trouble for subject change in this thread. But you hit the nail on the head in your comment with Hitachi, when they converted to lead-free they had a �5 times higher defect rate� i
Electronics Forum | Thu Dec 16 11:54:45 EST 1999 | Mike Naddra
At reflow an inert atmosphere is used to mitigate the occurance of oxidation, to me the decision weather to move from an inert atmosphere is based on several things ; PCB surface finish - are you using a HASL finish, OSP or another surface finish and
Electronics Forum | Wed Sep 05 16:04:47 EDT 2001 | Kelvin
Dear All, I am looking for a good wetting balance solderability tester. I hope this piece of equipment is maintence free, small dimension and robust. The most important is this equipment should comply with most of the industry test standard, like IP
Electronics Forum | Wed Dec 18 16:21:54 EST 2019 | jrow
Hello! We are having field failures due to cracking of the solder on our SMD micro switch components. I have been reading the IPC standards, and the only thing that it states regarding the solder profile/amount for Gull Wing component is "wetted fill
Electronics Forum | Fri Mar 23 00:12:55 EDT 2012 | posinpcbfactory
J-STD-003B prescribes test methods, defect > definitions and illustrations for assessing the > solderability of printed board surface > conductors, attachment lands, and plated-through > holes utilizing either tin/lead or lead-free > solders. Th
Electronics Forum | Fri Jan 20 11:44:40 EST 2006 | Mike Dolbow Atotalgps.com
I have seen 100% Matte Tin plating and a lot of Sn/Ag/Cu plating for gull wing parts. This is the most common type of plating. Also in a lead free process you will see that the very end Toe of the part will not flow. This is due to the metal being cu
Electronics Forum | Tue Dec 30 09:31:52 EST 2014 | rgduval
I've always approached it like this: Design your processes and perform your work to class three standards, and inspect to the standard that is acceptable. That is, all work should be performed to the highest degree of quality. When the work is ins
Electronics Forum | Thu Sep 03 04:53:31 EDT 2009 | d0min0
to summarize - 3 components are placed on a single module x 8 on pcb - 2 anodes & 1 cathode are infected (so no component for us) - the problem does not look like wetting problem as the component and land pad is wetted, but the paste is not complete
